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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Clausen, B.
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Publications (3/3 displayed)
- 2009KNOWN RESIDUAL STRESS SPECIMENS USING OPPOSED INDENTATIONcitations
- 2007Evidence of variation in slip mode in a polycrystalline nickel-base superalloy with change in temperature from neutron diffraction strain measurementscitations
- 2004Investigation of the bond strength between the photo-sensitive polymer SU-8 and Au
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document
Investigation of the bond strength between the photo-sensitive polymer SU-8 and Au
Abstract
We present the results from a thorough investigation of the bond strengthbetween the photo-polymer SU-8 and Au. The data were optained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that were investigated were: (i) different adhesion promotors between the SU-8 and Au (ii) the effect of the processing sequence, eitherkeeping SU-8 as bottum layer or Au (iii) varying the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. We report on bond strength of 4.8 +/- 1.2 MPa between a 7.5 micr.- layer of SU-8 and Au without any adhesion promoter. This value increases to 11.7 +/- 2.1 MPa for a 30 micr.- layer of SU-8. The value of the bond strength can be increased by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.