| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Van Driel, Willem
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2024Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
- 2023Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Applicationcitations
- 2022Interphase effect on the effective moisture diffusion in epoxy–SiO2 compositescitations
- 2021Facile synthesis of ag nanowire/tio2 and ag nanowire/tio2/go nanocomposites for photocatalytic degradation of rhodamine bcitations
- 2021Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approachescitations
- 2018Solid State Lighting Reliability Part 2
- 2016Creep fatigue models of solder jointscitations
- 2015An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic componentscitations
- 2010Designing for reliability using a new Wafer Level Package structure
- 2009Virtual Prototyping for PPM-level Failures in Microelectronic Packages
- 2009Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
- 2007Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults
- 2007Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Measuring the through-plane elastic modulus of thin polymer films in situ
- 2007Characterization of moisture properties of polymers for IC packaging
- 2006Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications
- 2005The precision of large radio continuum source catalogues. An application of the SPECFIND toolcitations
Places of action
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book
Solid State Lighting Reliability Part 2
Abstract
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs.<br/>This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.