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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Yang, D.
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Publications (10/10 displayed)
- 2024Improving the interfacial adhesion between recycled carbon fibres and polyphenylene sulphide by bio-inspired dopamine for advanced composites manufacturing
- 2024Investigation of the Dynamic Behaviour of H2 and D2 in a Kinetic Quantum Sieving System
- 2020Efficient light-emitting diodes from mixed-dimensional perovskites on a fluoride interfacecitations
- 2014Micromechanical experimental investigation of mudstonescitations
- 2011Carrier lifetime studies in diode structures on Si substrates with and without Ge dopingcitations
- 2010Designing for reliability using a new Wafer Level Package structure
- 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
- 2007Multifunctional Nanocrystalline Thin Films of Er2O3: Interplay between Nucleation Kinetics and Film Characteristicscitations
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Er2O3 as a high-K dielectric candidatecitations
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document
Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
Abstract
Transferring molding process is widely used in the plastic IC packaging. Die cracking failures due to transfer molding process may occur. In this paper, an investigation on the die fracture and its failure probability is conducted. The approaches and results of die strength characterization, FE modeling on the laminate-based packages, and simulation-based prediction of the die fracture probability rate are presented. Weibull statistics model was used to describe the probability distribution. Model parameters were obtained by fitting to the test results. 3D parametric FE models were established to conduct numerical simulations to predict the stress field and die fracture probability caused during the tranfer molding process. For a BGA package, the influence of the solder mask opening under the die on the fracture probability was investigated. For the capped MEMS, high stress levels are induced in the cap and the MEMS die during the molding process. The cavity size, cap thickness, the molding pressure, and the wafer surface finishing process have significant influcences on the fracture failure probability. It shows that improvement of die fracture probability can be achieved by changing the designs of the die surface finishing process to meet the reliability requirements.