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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Serdijn, Wouter A.
Delft University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implantscitations
- 2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implantscitations
- 2019The influence of soft encapsulation materials on the wireless power transfer links efficiency
- 2019Energy efficient sampling and conversion of bio-signals using time-mode circuits
- 2019Towards an Active Graphene-PDMS Implant
- 2018MEMS-Electronics Integration 2: A Smart Temperature Sensor for an Organ-on-a-chip Platform
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document
Towards an Active Graphene-PDMS Implant
Abstract
Neural interface in the form of microelectrodes are used to monitor and treat spinal cord injury and other neurological disorders by the means of recording and stimulation. Despite of the apparent result of these electrical interventions, understanding of the mechanism behind neural stimulation is still inadequate. The use of optical monitoring during implantation is limited due to the use of opaque electrode partially blocking the implantation site. While the use of transparent conductor for electrode is not uncommon in general electronics where indium tin oxide (ITO) is widely used for displays, however ITO is not suitable for implantation due to its brittle nature[1]. An alternative material to fabricate transparent electrodes is graphene, a single layer of carbon atom forming sp2 hybridization. Its high charge mobility, flexibility, mechanical strength and optical transparency make it suitable for various flexible electronics applications including implantable microelectrode arrays. In biomedical fields, graphene has shown potential application as biosensor, stimulation and recording electrode[2]. Although fabrication of graphene microelectrodes has been previously shown[3], graphene had to be transferred manually for each individual implant. The high temperature needed during graphene deposition makes device fabrication directly on the flexible material impossible. Instead, the fabrication process relies on a transferring process of graphene layer from growing medium with high thermal budget to another desired substrate. Manual transfer process of graphene is a skill-dependant process with low scalability. In this work, a method of fabricating encapsulated graphene electrodes in polydimethylsiloxane (PDMS) with a controlled wafer-scale graphene transfer is proposed. Graphene transfer is done by wafer-assisted PDMS-PDMS bonding to minimalize operator dependency. The novel use of PDMS as encapsulation material for graphene electrode is due to its biocompatibility, flexibility and optical transmittance. Difference in material characteristics, such as the thermal expansion coefficient has become one of the challenges during fabrication process. Despite of these challenges, the prospect of transparent implant has been shown in preliminary testing on optical transmittance of graphene layer on PDMS with up to 77% transmittance in the visible light spectrum. While full characterization of the device is still in progress, further results will be reported during the conference.