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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Yang, D.
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Topics
Publications (10/10 displayed)
- 2024Improving the interfacial adhesion between recycled carbon fibres and polyphenylene sulphide by bio-inspired dopamine for advanced composites manufacturing
- 2024Investigation of the Dynamic Behaviour of H2 and D2 in a Kinetic Quantum Sieving System
- 2020Efficient light-emitting diodes from mixed-dimensional perovskites on a fluoride interfacecitations
- 2014Micromechanical experimental investigation of mudstonescitations
- 2011Carrier lifetime studies in diode structures on Si substrates with and without Ge dopingcitations
- 2010Designing for reliability using a new Wafer Level Package structure
- 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
- 2007Multifunctional Nanocrystalline Thin Films of Er2O3: Interplay between Nucleation Kinetics and Film Characteristicscitations
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Er2O3 as a high-K dielectric candidatecitations
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article
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
Abstract
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. In order to minimize these stresses inorganic fillers are added. These fillers have several opposing effects on the residual stresses because they decrease the cure shrinkage and thermal contraction but increase the modulus below and above the glass transition temperature. In this paper an extensive study on the cure-dependent rubbery moduli of a series of silica spheres filled epoxy resins is carried out both experimentally and theoretically. Low frequency dynamic mechanical analysis (DMA) was used to measure the rubbery modulus build-up during cure. A model based on scaling analysis was applied to describe the evolution of the rubbery shear modulus. The effect of the filler percentage on the rubbery shear and bulk moduli as well as the coefficients of thermal expansion were measured and compared with models from the theory of particulate-filled composites.