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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Casati, R. |
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| Kočí, Jan | Prague |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ali, M. A. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Xiao, A.
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Topics
Publications (12/12 displayed)
- 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurementscitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature regioncitations
- 2008Mixed mode interface characterization considering thermal residual stresscitations
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008Interface characterization and failure modeling for Semiconductor packagescitations
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
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document
Delamination and combined compound cracking of EMC-copper interfaces
Abstract
The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1-2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.