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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Wunderle, B.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (32/32 displayed)
- 2020Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
- 2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrixcitations
- 2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructurescitations
- 2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
- 2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metalscitations
- 2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopycitations
- 2016Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperaturecitations
- 2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metalscitations
- 2016A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
- 2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip packagecitations
- 2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
- 2014In situ monitoring of interface delamination by the 3o-methodcitations
- 2012Determination of interface fracture parameters by shear testing using different theoretical approachescitations
- 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
- 2010Interfacial fracture parameters of silicon-to-molding compound
- 2009Influence of moisture on the time and temperature dependent properties of polymer systemscitations
- 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurementscitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packagescitations
- 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature regioncitations
- 2008Mixed mode interface characterization considering thermal residual stresscitations
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008Interface characterization and failure modeling for Semiconductor packagescitations
- 2007Reliability of SnPb and Pb-free flip-chips under different test conditionscitations
- 2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test conceptcitations
- 2007Failure Analysis of Microelectronic Packages by Pulse IR Thermography
- 2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysiscitations
- 2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contactscitations
- 2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimencitations
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document
Delamination and combined compound cracking of EMC-copper interfaces
Abstract
The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1-2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.