Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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693.932 PEOPLE
693.932 People People

693.932 People

Show results for 693.932 people that are selected by your search filters.

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PeopleLocationsStatistics
Naji, M.
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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (7/7 displayed)

  • 2024A numerical study into the effect of defects and meso-scale variability on properties of discontinuous long fibre thermoplastic compositescitations
  • 2024Experimental characterising of the interfacial bond strength in overmoulded thermoplastic compositescitations
  • 2024Weld lines in discontinuous long-fibre thermoplastic compositescitations
  • 2023Pressing-and-folding of discontinuous long fibre thermoplastic composites as an alternative to direct compationcitations
  • 2023Stress transfer in discontinuous aligned thermoplastic composite tapes - An experimental and numerical studycitations
  • 2009Modeling and characterization of molding compound properties during curecitations
  • 2008Characterization and modeling of molding compound properties during curecitations

Places of action

Chart of shared publication
Peijs, Ton
5 / 237 shared
Abass, H.
2 / 2 shared
Reynolds, N.
5 / 6 shared
Serrano Villalobos, C.
1 / 1 shared
Gupta, J.
1 / 2 shared
Gnanadass, S.
1 / 1 shared
Groves, R.
2 / 2 shared
Van Den Aker, R.
2 / 2 shared
Wilson, P.
1 / 5 shared
Goutianos, S.
1 / 20 shared
Kessler, A.
2 / 5 shared
Bohm, C.
2 / 10 shared
Stecher, M.
2 / 4 shared
Preu, H.
2 / 6 shared
Jansen, Kaspar
2 / 48 shared
Ernst, Lj
2 / 26 shared
Chart of publication period
2024
2023
2009
2008

Co-Authors (by relevance)

  • Peijs, Ton
  • Abass, H.
  • Reynolds, N.
  • Serrano Villalobos, C.
  • Gupta, J.
  • Gnanadass, S.
  • Groves, R.
  • Van Den Aker, R.
  • Wilson, P.
  • Goutianos, S.
  • Kessler, A.
  • Bohm, C.
  • Stecher, M.
  • Preu, H.
  • Jansen, Kaspar
  • Ernst, Lj
OrganizationsLocationPeople

article

Modeling and characterization of molding compound properties during cure

  • Kessler, A.
  • Bohm, C.
  • Stecher, M.
  • Preu, H.
  • Jansen, Kaspar
  • Ernst, Lj
  • Qian, C.
Abstract

During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.

Topics
  • compound
  • curing