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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Xiao, A.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurementscitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature regioncitations
- 2008Mixed mode interface characterization considering thermal residual stresscitations
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008Interface characterization and failure modeling for Semiconductor packagescitations
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
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document
Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
Abstract
Warpage is a critical issue for a QFN panel molding process. Much work was done in the past to predict the warpage of a package during cooling down from molding temperature. However, until now, warpage could not always be predicted well, even if the viscoelastic behavior of the molding compound is taken into account. It was for example observed that the cooling velocity affected the warpage after cooling down. Because of this reason, the mechanical behavior of the molding compound was investigated in more detail. In this research, the mechanical properties of the molding compound are determined. It turned out that the properties are highly dependent on time and temperature. A complete viscoelastic model of the model compound is achieved by combining DMA and dilatometric test results. The model is implemented in the finite element software ABAQUS. In this study, our advanced model is compared with elastic calculations which are normally done. A validation experiment is performed in which simulation results are compared with experimental warpage data of a double layered beam, consisting of a layer of molding compound and a layer of silicon. This beam is cooled down from a temperature above Tg to room temperature with different cooling rates. In the meantime warpage is measured and compared to simulation results. Finally, the advanced material model is used for calculations on a QFN-panel.