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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Schlottig, G.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2016Intra-stack sealing of tier interconnects using the interconnect alloycitations
- 2015Nanoparticle assembly and sintering towards all-copper flip chip interconnectscitations
- 2011Delamination Toughness of Cu-EMC Interfaces at Harsh Environment
- 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
- 2010Interfacial fracture parameters of silicon-to-molding compound
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurementscitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2008Mixed mode interface characterization considering thermal residual stresscitations
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document
Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
Abstract
Microelectronic packages can be considered as composite structures fabricated from highly dissimilar materials. Interface delamination related failure often occurs when the packaged devices are subjected to thermo-mechanical loading. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in thermal mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the crack propagates under mixed mode conditions. In this paper, the interface toughness of epoxy molding compound - copper interface in IC packages is characterized. The test specimen is directly obtained from a production process line. A small-size multi-functional mixed mode bending (MMB) tool was designed and fabricated. For measurements under various temperatures and moisture conditions, a special climate chamber is designed. The ¿current crack length¿ is required for the interpretation of measurement results through FEM-fracture mechanics simulations. Therefore, during testing the ¿current crack length¿ is captured using a CCD camera. The critical fracture properties are obtained by interpreting the experimental results through finite element modeling. As input parameters, the material properties are both experimentally and numerically characterized as functions of temperature and moisture. In order to get more accurate interfacial toughness, the influence of residual stresses in the sample is considered.