| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jansen, Kaspar
Delft University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (48/48 displayed)
- 2024Design and modelling of a reversible shape memory alloy torsion hinge actuatorcitations
- 2024Mimosa
- 2023Affine Deformation and Self-Assembly Alignment in Hydrogel Nanocomposites
- 2023Shape memory alloy actuators for haptic wearablescitations
- 2022The unfolding of textileness in animated textiles:citations
- 2022Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 2021Experimental testing on semi-active vibration control through adaptive structural joints
- 2021Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 20214D printing of reconfigurable metamaterials and devices
- 2020Design and characterization of variable stiffness structural jointscitations
- 2019Characterization of variable stiffness joints for adaptive structurescitations
- 2018Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditionscitations
- 2017Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumptioncitations
- 2016Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrixcitations
- 2016Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocompositescitations
- 2016Functional Demonstrators to Support Understanding of Smart Materialscitations
- 2016Numerical investigation and experimental validation of residual stresses building up in microelectronics packagingcitations
- 2016Thermo-viscoelastic analysis of GLAREcitations
- 2016Composition dependent properties of graphene (oxide)-alginate biopolymer nanocompositescitations
- 2016Effect of fiber-matrix adhesion on the creep behavior of CF/PPS compositescitations
- 2011Delamination Toughness of Cu-EMC Interfaces at Harsh Environment
- 2011Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
- 2011Analytical estimate for cure-induced stresses and warpage in flat packages
- 2010High temperature storage influence on molding compound properties
- 2010Prediction of cure induced warpage of micro-electronic products
- 2010Theory of aluminum metallization corrosion in microelectronics
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Interfacial fracture parameters of silicon-to-molding compound
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2010Thermal aging of molding compounds
- 2009Modeling and characterization of molding compound properties during cure
- 2009Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics componentscitations
- 2009Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation
- 2009Cure induced Warpage of micro-electronics: comparison with experiments
- 2009Moisture absorption and hygroscopic swelling characterization of molding compound
- 2009Comprehensive material characterization of organic packaging materialscitations
- 2009Effect of Postcure and Thermal Aging on Molding Compound Properties
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
- 2008Characterization and modeling of molding compound properties during cure
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Measuring the through-plane elastic modulus of thin polymer films in situ
- 2007Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
- 2007Characterization of moisture properties of polymers for IC packaging
- 2005State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Places of action
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document
Effect of aging of packaging materials on die surface cracking of a SiP carrier
Abstract
Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180ºC. Before the test, first the samples are pre-dried at 125ºC for 24 hours and then preconditioned at 60ºC/60%RH for 40 hours. Secondly, one reflow at 260ºC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65ºC to 150ºC and every cycle is finished in 30 minutes. For the DMA test, a TA instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.