Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Naji, M.
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Wunderle, B.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (32/32 displayed)

  • 2020Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDscitations
  • 2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix3citations
  • 2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures2citations
  • 2016Packaging and characterization of silicon and SiC-based power inverter module with double sided coolingcitations
  • 2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals8citations
  • 2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy4citations
  • 2016Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature62citations
  • 2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals1citations
  • 2016A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metalscitations
  • 2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package7citations
  • 2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analyticscitations
  • 2014In situ monitoring of interface delamination by the 3o-method3citations
  • 2012Determination of interface fracture parameters by shear testing using different theoretical approaches17citations
  • 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughnesscitations
  • 2010Delamination and combined compound cracking of EMC-copper interfacescitations
  • 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughnesscitations
  • 2010Interfacial fracture parameters of silicon-to-molding compoundcitations
  • 2009Influence of moisture on the time and temperature dependent properties of polymer systems12citations
  • 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurements8citations
  • 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperatures13citations
  • 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperatures13citations
  • 2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages20citations
  • 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature region13citations
  • 2008Mixed mode interface characterization considering thermal residual stress8citations
  • 2008Interfacial Fracture Properties and Failure Modeling for Microelectronics19citations
  • 2008Interface characterization and failure modeling for Semiconductor packages15citations
  • 2007Reliability of SnPb and Pb-free flip-chips under different test conditions18citations
  • 2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept31citations
  • 2007Failure Analysis of Microelectronic Packages by Pulse IR Thermographycitations
  • 2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis23citations
  • 2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts4citations
  • 2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen10citations

Places of action

Chart of shared publication
Elger, G.
1 / 10 shared
Liu, E.
1 / 8 shared
Conti, F.
1 / 6 shared
Bhogaraju, S. K.
1 / 6 shared
Keller, J.
3 / 13 shared
Grosse, C.
1 / 9 shared
Ras, M. A.
1 / 1 shared
May, D.
3 / 18 shared
Wöhrmann, M.
2 / 4 shared
Bader, V.
1 / 14 shared
Wolf, M. J.
1 / 9 shared
Stiebing, M.
1 / 1 shared
Vogel, D.
1 / 13 shared
Steller, W.
1 / 2 shared
Zschenderlein, U.
1 / 2 shared
Ehrhardt, C.
1 / 3 shared
Lang, K.-D.
1 / 30 shared
Mitova, R.
1 / 1 shared
Sarkany, Z.
1 / 1 shared
Maurer, W.
1 / 2 shared
Dietrich, L.
1 / 7 shared
Oppermann, H.
1 / 12 shared
Manier, Charles-Alix
1 / 2 shared
Rencz, M.
1 / 5 shared
Hoelck, O.
1 / 2 shared
Blaudeck, T.
2 / 2 shared
Sturm, Heinz
2 / 38 shared
Hartmann, S.
6 / 10 shared
Schulz, Se
1 / 1 shared
Hermann, S.
5 / 8 shared
Gessner, T.
4 / 22 shared
Mehner, J.
2 / 7 shared
Bonitz, J.
4 / 4 shared
Heggen, M.
4 / 13 shared
Hölck, O.
3 / 5 shared
Shaporin, A.
2 / 2 shared
Schulz, S. E.
4 / 18 shared
Grant, P.
1 / 79 shared
Marques, V.
1 / 3 shared
Johnston, C.
1 / 16 shared
Abo Ras, M.
1 / 7 shared
Schulz, M.
2 / 17 shared
Sheva, S.
2 / 2 shared
Bauer, J.
1 / 24 shared
Meszmer, P.
1 / 1 shared
Walter, H.
6 / 25 shared
Mroßko, R.
1 / 2 shared
Yang, G.
1 / 9 shared
Pufall, R.
1 / 7 shared
Brämer, B.
1 / 2 shared
Seiler, B.
1 / 4 shared
Auersperg, J.
1 / 4 shared
Dudek, R.
3 / 16 shared
Jansen, K. M. B.
6 / 19 shared
Schlottig, G.
8 / 12 shared
Xiao, A.
10 / 12 shared
Pape, H.
11 / 13 shared
Ernst, L. J.
6 / 15 shared
Jansen, Kaspar
3 / 48 shared
Ernst, Lj
3 / 26 shared
Maus, I.
1 / 2 shared
Shirangi, H.
1 / 2 shared
Dermitzaki, E.
1 / 1 shared
Michel, B.
8 / 37 shared
Ernst, L.
1 / 1 shared
Ernst, Lj Leo
1 / 2 shared
Jansen, Kmb
1 / 2 shared
Sluis, O. Van Der
1 / 9 shared
Sluis, Van Der, O.
1 / 16 shared
Shirangi, M. H.
1 / 4 shared
Wittler, O.
1 / 9 shared
Vreugd, J. De
2 / 12 shared
Möller, A.
1 / 5 shared
Spraul, M.
1 / 1 shared
Nüchter, W.
3 / 3 shared
Boehme, B.
1 / 5 shared
Wolter, K.-J.
2 / 23 shared
Roellig, M.
2 / 11 shared
Wiese, S.
2 / 16 shared
Schacht, R.
2 / 3 shared
Deplanque, S.
2 / 2 shared
Chart of publication period
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2018
2017
2016
2015
2014
2012
2011
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2004

Co-Authors (by relevance)

  • Elger, G.
  • Liu, E.
  • Conti, F.
  • Bhogaraju, S. K.
  • Keller, J.
  • Grosse, C.
  • Ras, M. A.
  • May, D.
  • Wöhrmann, M.
  • Bader, V.
  • Wolf, M. J.
  • Stiebing, M.
  • Vogel, D.
  • Steller, W.
  • Zschenderlein, U.
  • Ehrhardt, C.
  • Lang, K.-D.
  • Mitova, R.
  • Sarkany, Z.
  • Maurer, W.
  • Dietrich, L.
  • Oppermann, H.
  • Manier, Charles-Alix
  • Rencz, M.
  • Hoelck, O.
  • Blaudeck, T.
  • Sturm, Heinz
  • Hartmann, S.
  • Schulz, Se
  • Hermann, S.
  • Gessner, T.
  • Mehner, J.
  • Bonitz, J.
  • Heggen, M.
  • Hölck, O.
  • Shaporin, A.
  • Schulz, S. E.
  • Grant, P.
  • Marques, V.
  • Johnston, C.
  • Abo Ras, M.
  • Schulz, M.
  • Sheva, S.
  • Bauer, J.
  • Meszmer, P.
  • Walter, H.
  • Mroßko, R.
  • Yang, G.
  • Pufall, R.
  • Brämer, B.
  • Seiler, B.
  • Auersperg, J.
  • Dudek, R.
  • Jansen, K. M. B.
  • Schlottig, G.
  • Xiao, A.
  • Pape, H.
  • Ernst, L. J.
  • Jansen, Kaspar
  • Ernst, Lj
  • Maus, I.
  • Shirangi, H.
  • Dermitzaki, E.
  • Michel, B.
  • Ernst, L.
  • Ernst, Lj Leo
  • Jansen, Kmb
  • Sluis, O. Van Der
  • Sluis, Van Der, O.
  • Shirangi, M. H.
  • Wittler, O.
  • Vreugd, J. De
  • Möller, A.
  • Spraul, M.
  • Nüchter, W.
  • Boehme, B.
  • Wolter, K.-J.
  • Roellig, M.
  • Wiese, S.
  • Schacht, R.
  • Deplanque, S.
OrganizationsLocationPeople

document

Interfacial fracture parameters of silicon-to-molding compound

  • Walter, H.
  • Schlottig, G.
  • Jansen, Kaspar
  • Maus, I.
  • Pape, H.
  • Wunderle, B.
  • Ernst, Lj
Abstract

The rapid diversification in microelectronics forebodes more complex system integration, be it for denser function integration or a span of dimensions between various technologies. Products may include more features, perform faster and be cheaper. With these trends the amount of material layers is increasing. This challenges development to a faster rating of material pairings. Delamination is a major issue among the related reliability aspects. When the design or testing steps are accompanied by simulation, fracture mechanical descriptions are increasingly proving helpful. The parameters needed for simulation have to be measured and should be available for different fracture mode mix angles. We investigated the interfacial fracture toughness of the Epoxy Molding Compound (EMC) to Silicon interface. Although difficult to delaminate we could carry out measurements using the Mixed Mode Chisel setup (MMC) that allowed us to induce different stress states at the crack tip at various external load angles. The samples we derived from the molding process of embedded wafer level ball grid arrays. Therefore we were able to use samples made with the same process as in real packaging. The crack tip position was determined by analysis of displacement results by digital image correlation. In order to interpret the sample reaction for extracting fracture mechanical parameters, adequate numerical modeling and simulation was required. The experiments provided the parameters for the models. Establishing the residual stress state in the materials preceded the interface delamination simulation: a two step interpretation. Residual stresses cannot be neglected; indeed they are part of the challenges to delaminate this interface at all. We found energy release rates increasing with fracture mode mix, and such values close to pure tensile opening at the crack tip. We recommend to exclude data from short crack lengths and to carefully expose the sample flanks. The results promise to extend the available interfacial fracture data soon.

Topics
  • impedance spectroscopy
  • compound
  • experiment
  • simulation
  • crack
  • Silicon
  • interfacial
  • fracture toughness
  • metal-matrix composite