| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jansen, Kaspar
Delft University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (48/48 displayed)
- 2024Design and modelling of a reversible shape memory alloy torsion hinge actuatorcitations
- 2024Mimosa
- 2023Affine Deformation and Self-Assembly Alignment in Hydrogel Nanocomposites
- 2023Shape memory alloy actuators for haptic wearablescitations
- 2022The unfolding of textileness in animated textiles:citations
- 2022Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 2021Experimental testing on semi-active vibration control through adaptive structural joints
- 2021Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 20214D printing of reconfigurable metamaterials and devices
- 2020Design and characterization of variable stiffness structural jointscitations
- 2019Characterization of variable stiffness joints for adaptive structurescitations
- 2018Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditionscitations
- 2017Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumptioncitations
- 2016Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrixcitations
- 2016Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocompositescitations
- 2016Functional Demonstrators to Support Understanding of Smart Materialscitations
- 2016Numerical investigation and experimental validation of residual stresses building up in microelectronics packagingcitations
- 2016Thermo-viscoelastic analysis of GLAREcitations
- 2016Composition dependent properties of graphene (oxide)-alginate biopolymer nanocompositescitations
- 2016Effect of fiber-matrix adhesion on the creep behavior of CF/PPS compositescitations
- 2011Delamination Toughness of Cu-EMC Interfaces at Harsh Environment
- 2011Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
- 2011Analytical estimate for cure-induced stresses and warpage in flat packages
- 2010High temperature storage influence on molding compound properties
- 2010Prediction of cure induced warpage of micro-electronic products
- 2010Theory of aluminum metallization corrosion in microelectronics
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Interfacial fracture parameters of silicon-to-molding compound
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2010Thermal aging of molding compounds
- 2009Modeling and characterization of molding compound properties during cure
- 2009Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics componentscitations
- 2009Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation
- 2009Cure induced Warpage of micro-electronics: comparison with experiments
- 2009Moisture absorption and hygroscopic swelling characterization of molding compound
- 2009Comprehensive material characterization of organic packaging materialscitations
- 2009Effect of Postcure and Thermal Aging on Molding Compound Properties
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
- 2008Characterization and modeling of molding compound properties during cure
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Measuring the through-plane elastic modulus of thin polymer films in situ
- 2007Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
- 2007Characterization of moisture properties of polymers for IC packaging
- 2005State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Places of action
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document
Interfacial fracture parameters of silicon-to-molding compound
Abstract
The rapid diversification in microelectronics forebodes more complex system integration, be it for denser function integration or a span of dimensions between various technologies. Products may include more features, perform faster and be cheaper. With these trends the amount of material layers is increasing. This challenges development to a faster rating of material pairings. Delamination is a major issue among the related reliability aspects. When the design or testing steps are accompanied by simulation, fracture mechanical descriptions are increasingly proving helpful. The parameters needed for simulation have to be measured and should be available for different fracture mode mix angles. We investigated the interfacial fracture toughness of the Epoxy Molding Compound (EMC) to Silicon interface. Although difficult to delaminate we could carry out measurements using the Mixed Mode Chisel setup (MMC) that allowed us to induce different stress states at the crack tip at various external load angles. The samples we derived from the molding process of embedded wafer level ball grid arrays. Therefore we were able to use samples made with the same process as in real packaging. The crack tip position was determined by analysis of displacement results by digital image correlation. In order to interpret the sample reaction for extracting fracture mechanical parameters, adequate numerical modeling and simulation was required. The experiments provided the parameters for the models. Establishing the residual stress state in the materials preceded the interface delamination simulation: a two step interpretation. Residual stresses cannot be neglected; indeed they are part of the challenges to delaminate this interface at all. We found energy release rates increasing with fracture mode mix, and such values close to pure tensile opening at the crack tip. We recommend to exclude data from short crack lengths and to carefully expose the sample flanks. The results promise to extend the available interfacial fracture data soon.