Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Naji, M.
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Wunderle, B.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (32/32 displayed)

  • 2020Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDscitations
  • 2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix3citations
  • 2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures2citations
  • 2016Packaging and characterization of silicon and SiC-based power inverter module with double sided coolingcitations
  • 2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals8citations
  • 2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy4citations
  • 2016Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature62citations
  • 2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals1citations
  • 2016A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metalscitations
  • 2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package7citations
  • 2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analyticscitations
  • 2014In situ monitoring of interface delamination by the 3o-method3citations
  • 2012Determination of interface fracture parameters by shear testing using different theoretical approaches17citations
  • 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughnesscitations
  • 2010Delamination and combined compound cracking of EMC-copper interfacescitations
  • 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughnesscitations
  • 2010Interfacial fracture parameters of silicon-to-molding compoundcitations
  • 2009Influence of moisture on the time and temperature dependent properties of polymer systems12citations
  • 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurements8citations
  • 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperatures13citations
  • 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperatures13citations
  • 2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages20citations
  • 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature region13citations
  • 2008Mixed mode interface characterization considering thermal residual stress8citations
  • 2008Interfacial Fracture Properties and Failure Modeling for Microelectronics19citations
  • 2008Interface characterization and failure modeling for Semiconductor packages15citations
  • 2007Reliability of SnPb and Pb-free flip-chips under different test conditions18citations
  • 2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept31citations
  • 2007Failure Analysis of Microelectronic Packages by Pulse IR Thermographycitations
  • 2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis23citations
  • 2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts4citations
  • 2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen10citations

Places of action

Chart of shared publication
Elger, G.
1 / 10 shared
Liu, E.
1 / 8 shared
Conti, F.
1 / 6 shared
Bhogaraju, S. K.
1 / 6 shared
Keller, J.
3 / 13 shared
Grosse, C.
1 / 9 shared
Ras, M. A.
1 / 1 shared
May, D.
3 / 18 shared
Wöhrmann, M.
2 / 4 shared
Bader, V.
1 / 14 shared
Wolf, M. J.
1 / 9 shared
Stiebing, M.
1 / 1 shared
Vogel, D.
1 / 13 shared
Steller, W.
1 / 2 shared
Zschenderlein, U.
1 / 2 shared
Ehrhardt, C.
1 / 3 shared
Lang, K.-D.
1 / 30 shared
Mitova, R.
1 / 1 shared
Sarkany, Z.
1 / 1 shared
Maurer, W.
1 / 2 shared
Dietrich, L.
1 / 7 shared
Oppermann, H.
1 / 12 shared
Manier, Charles-Alix
1 / 2 shared
Rencz, M.
1 / 5 shared
Hoelck, O.
1 / 2 shared
Blaudeck, T.
2 / 2 shared
Sturm, Heinz
2 / 38 shared
Hartmann, S.
6 / 10 shared
Schulz, Se
1 / 1 shared
Hermann, S.
5 / 8 shared
Gessner, T.
4 / 22 shared
Mehner, J.
2 / 7 shared
Bonitz, J.
4 / 4 shared
Heggen, M.
4 / 13 shared
Hölck, O.
3 / 5 shared
Shaporin, A.
2 / 2 shared
Schulz, S. E.
4 / 18 shared
Grant, P.
1 / 79 shared
Marques, V.
1 / 3 shared
Johnston, C.
1 / 16 shared
Abo Ras, M.
1 / 7 shared
Schulz, M.
2 / 17 shared
Sheva, S.
2 / 2 shared
Bauer, J.
1 / 24 shared
Meszmer, P.
1 / 1 shared
Walter, H.
6 / 25 shared
Mroßko, R.
1 / 2 shared
Yang, G.
1 / 9 shared
Pufall, R.
1 / 7 shared
Brämer, B.
1 / 2 shared
Seiler, B.
1 / 4 shared
Auersperg, J.
1 / 4 shared
Dudek, R.
3 / 16 shared
Jansen, K. M. B.
6 / 19 shared
Schlottig, G.
8 / 12 shared
Xiao, A.
10 / 12 shared
Pape, H.
11 / 13 shared
Ernst, L. J.
6 / 15 shared
Jansen, Kaspar
3 / 48 shared
Ernst, Lj
3 / 26 shared
Maus, I.
1 / 2 shared
Shirangi, H.
1 / 2 shared
Dermitzaki, E.
1 / 1 shared
Michel, B.
8 / 37 shared
Ernst, L.
1 / 1 shared
Ernst, Lj Leo
1 / 2 shared
Jansen, Kmb
1 / 2 shared
Sluis, O. Van Der
1 / 9 shared
Sluis, Van Der, O.
1 / 16 shared
Shirangi, M. H.
1 / 4 shared
Wittler, O.
1 / 9 shared
Vreugd, J. De
2 / 12 shared
Möller, A.
1 / 5 shared
Spraul, M.
1 / 1 shared
Nüchter, W.
3 / 3 shared
Boehme, B.
1 / 5 shared
Wolter, K.-J.
2 / 23 shared
Roellig, M.
2 / 11 shared
Wiese, S.
2 / 16 shared
Schacht, R.
2 / 3 shared
Deplanque, S.
2 / 2 shared
Chart of publication period
2020
2018
2017
2016
2015
2014
2012
2011
2010
2009
2008
2007
2006
2005
2004

Co-Authors (by relevance)

  • Elger, G.
  • Liu, E.
  • Conti, F.
  • Bhogaraju, S. K.
  • Keller, J.
  • Grosse, C.
  • Ras, M. A.
  • May, D.
  • Wöhrmann, M.
  • Bader, V.
  • Wolf, M. J.
  • Stiebing, M.
  • Vogel, D.
  • Steller, W.
  • Zschenderlein, U.
  • Ehrhardt, C.
  • Lang, K.-D.
  • Mitova, R.
  • Sarkany, Z.
  • Maurer, W.
  • Dietrich, L.
  • Oppermann, H.
  • Manier, Charles-Alix
  • Rencz, M.
  • Hoelck, O.
  • Blaudeck, T.
  • Sturm, Heinz
  • Hartmann, S.
  • Schulz, Se
  • Hermann, S.
  • Gessner, T.
  • Mehner, J.
  • Bonitz, J.
  • Heggen, M.
  • Hölck, O.
  • Shaporin, A.
  • Schulz, S. E.
  • Grant, P.
  • Marques, V.
  • Johnston, C.
  • Abo Ras, M.
  • Schulz, M.
  • Sheva, S.
  • Bauer, J.
  • Meszmer, P.
  • Walter, H.
  • Mroßko, R.
  • Yang, G.
  • Pufall, R.
  • Brämer, B.
  • Seiler, B.
  • Auersperg, J.
  • Dudek, R.
  • Jansen, K. M. B.
  • Schlottig, G.
  • Xiao, A.
  • Pape, H.
  • Ernst, L. J.
  • Jansen, Kaspar
  • Ernst, Lj
  • Maus, I.
  • Shirangi, H.
  • Dermitzaki, E.
  • Michel, B.
  • Ernst, L.
  • Ernst, Lj Leo
  • Jansen, Kmb
  • Sluis, O. Van Der
  • Sluis, Van Der, O.
  • Shirangi, M. H.
  • Wittler, O.
  • Vreugd, J. De
  • Möller, A.
  • Spraul, M.
  • Nüchter, W.
  • Boehme, B.
  • Wolter, K.-J.
  • Roellig, M.
  • Wiese, S.
  • Schacht, R.
  • Deplanque, S.
OrganizationsLocationPeople

conferencepaper

Interfacial Fracture Properties and Failure Modeling for Microelectronics

  • Vreugd, J. De
  • Xiao, A.
  • Jansen, Kaspar
  • Pape, H.
  • Wunderle, B.
  • Ernst, Lj
Abstract

S.1724-1730 ; Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the crack propagates under mixed mode conditions. The present study deals with delamination toughness measurements of an epoxy molding compound - copper lead frame interface as directly obtained from a real production process. As a consequence the specimen dimensions are relatively small and therefore a dedicated small-size test set-up was designed and fabricated. The test setup allows transferring two separated loadings (mode I and mode II) on a single specimen. The setup is flexible and adjustable for measuring specimens with various dimensions. For measurements under various temperatures and moisture conditions, a special climate chamber is designed. The ?current crack length? is required for the interpretation of measurement results through FEM-fracture mechanics simulations. Therefore, during testing the "current crack length" is captured using a CCD camera and a micro deformation analysis system (MicroDac). The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling.

Topics
  • impedance spectroscopy
  • compound
  • simulation
  • crack
  • copper
  • interfacial