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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Partridge, Ivana K.
University of Bristol
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2024Effects of accelerated curing in thermoplastic particle interleaf epoxy laminatescitations
- 2019Coupon scale Z-pinned IM7/8552 delamination tests under dynamic loadingcitations
- 2019Effective use of metallic Z-pins for composites' through-thickness reinforcementcitations
- 2018COUPON SCALE MODELLING OF THE BRIDGING MECHANICS OF HIGH-RATE LOADED Z-PINS
- 2018Dynamic bridging mechanisms of through-thickness reinforced composite laminates in mixed mode delaminationcitations
- 2018Evaluating Z-pin performance under high-velocity impact conditions
- 2017Dynamic bridging mechanisms of through-thickness reinforced composite laminates in mixed mode delaminationcitations
- 2016Understanding and prediction of fibre waviness defect generation
- 2016Use of microfasteners to produce damage tolerant composite structurescitations
- 2016On the delamination self-sensing function of Z-pinned composite laminatescitations
- 2016Developing cure kinetics models for interleaf particle toughened epoxies
- 2015Delamination resistance of composites using inclined Z-pins
- 2012Finite element modelling of z-pinned composite T-jointscitations
- 2012Cure kinetics, glass transition temperature development, and dielectric spectroscopy of a low temperature cure epoxy/amine systemcitations
- 2012RTM processing and electrical performance of carbon nanotube modified epoxy/fibre compositescitations
- 2012RTM processing and electrical performance of carbon nanotube modified epoxy/fibre compositescitations
- 2010Percolation threshold of carbon nanotubes filled unsaturated polyesterscitations
- 2010Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the curecitations
- 2009Monitoring Cure in Epoxies Containing Carbon Nanotubes with an Optical-Fiber Fresnel Refractometercitations
- 2009Dielectric monitoring of carbon nanotube network formation in curing thermosetting nanocompositescitations
- 2009Monitoring dispersion of carbon nanotubes in a thermosetting polyester resincitations
- 2008Thermomechanical analysis of a toughened thermosetting system
- 2008Thermomechanical analysis of a toughened thermosetting system.citations
- 2007Exploring mechanical property balance in tufted carbon fabric/epoxy composites.citations
- 2004Inverse heat transfer for optimization and on-line thermal properties estimation in composites curing.citations
Places of action
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document
COUPON SCALE MODELLING OF THE BRIDGING MECHANICS OF HIGH-RATE LOADED Z-PINS
Abstract
This work presents an advanced finite element model that can be used to investigate and understand the high-loading-rate bridging mechanisms of z-pins. A group of ply-level meshes are used to consider the microstructures of z-pin array reinforced laminates. Resin matrix is described by an elasto-plastic model that is dependent on both hydrostatic pressure and loading rate. The interface between the z-pin and the laminate is described by a coupled cohesive and friction contact algorithm; a friction term is added on top of Coulomb friction to consider the singularities and roughness of z-pin and hole surfaces, which are difficult to mesh out by finite elements. To improve computational efficiency, each z-pin is described by a homogenised mesh and a nonlinear shear constitutive law to account for the variation of z-pin bending stiffness due to splitting. Rupture of z-pin is described by the maximum tensile stress criterion with the tensile strength described by the Weibull criterion. The model was preliminarily applied to simulate the mode I high rate bridging behaviour of a 4 × 4 T300/BMI composite z-pin array when inserted in a quasi isotropic laminate. The numerical model has successfully captured z-pin/laminte debonding and frictional pullout.