693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Strusevich, N.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2013Computational modeling of electrodepostion in small features under megasonic agitation
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation
Places of action
| Organizations | Location | People |
|---|
document
Computational modeling of electrodepostion in small features under megasonic agitation
Abstract
This paper considers copper electrodeposition processes in microvias and verifies whether the quality of electroplating can be improved in the presence of acoustic streaming generated by a megasonic transducers placed into a plating cell. Our numerical experiments demonstrate that an improvement of cupric ion transport is observed in the area close to the mouth of a via, and that leads to fillings of better quality compared to those achieved under basic conditions. On the other hand, acoustic streaming inside the via has no major impact. The reasons for this lack of impact are different for blind vias and through vias.