| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Roy, Sudipta
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Modelling the scaling-up of the nickel electroforming processcitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2019Electrodeposition of Fe-Sn from the chloride-based electrolytecitations
- 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applications
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Pt-Ni Subsurface Alloy Catalystscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gapcitations
- 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approachcitations
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2015A soluble molecular variant of the semiconducting silicondiselenidecitations
- 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acidcitations
- 2015Codeposition of Cu-Sn from ethaline deep eutectic solventcitations
- 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gapcitations
- 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DEScitations
- 2012Pulse Plating
Places of action
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document
Electrodeposition of Cu from a water-containing deep eutectic solvent
Abstract
Ionic Liquids (ILs) have been proposed as alternatives electrolytes for metal electrodeposition. Deep Eutectic Solvents (DESs) are a novel type of ILs tolerant to water. Moreover, DESs formulated from quaternary ammonium salts and hydrogen bond donors are promising electrolytes since they are water tolerant and they are available at a reasonable cost. Although DESs are hygroscopic and absorb water from the atmosphere, earlier studies to plate Cu have concentrated on low-water containing DESs (<0.5 wt% H2O). However, for DESs to become exploitable, metal deposition from water-containing electrolytes requires to be investigated. In this work, we have endeavoured to establish a quantitative correlation that might explain the effect of water content on the electrolyte and on Cu deposition process. The intrinsic concentration of water in the electrolyte was measured using Karl Fischer titration. Thereafter, to quantify the electrolyte uptake of water a time-dependant test was conducted. After adding various concentration of water to the electrolyte determined from the time-dependant experiment (3 to 15 wt%), the influence of water content was examined with polarisation experiments collected using a rotating disc electrode. Finally, Cu deposition was carried on steel substrata from electrolytes containing different weight percentages of water. Cu deposits were characterised with Scanning Electron Microscopy (SEM) (Figure 1) and Energy Dispersive X-ray Spectroscopy (EDS).Different water contents in the electrolyte reduced the viscosity of the liquid which promotes the diffusivity of Cu2+ ions in the liquid. As a result, the limiting currents of the process increased. Higher water content changed the morphology of Cu films. Even at low water content (~3 wt%), the current distribution on the deposits is non-uniform. Furthermore, adding H2O worsens the already uneven current distribution leading to less uniform Cu deposits.