• Konkova, Tatyana
• Reshetov, A. V.
• Kuznetsov, A. A.
• Dobatkin, S. V.
• Synkov, A. S.
• Salischev, G. A.

Abstract

The structure and properties of oxygen-free copper (99.98%) were studied after different schemes of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), twist extrusion (TE), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30−50). The SPD causes the formation of submicrocrystalline structure with a grain size of 200−250 nm and predominantly high angle boundaries (75−94%). ECAP leads to the formation of the most uniform structure. The strength characteristics increase with increasing the strain and reach the steady stage at ε ≈ 5. At the steady stage, σВ = = 460−480 MPa at ARB, MD, and TE, while at ECAP σВ = 430−440 MPa. The smallest «steady» values of δ = 4−5% were obtained in the case of ARB, and the maximum δ = 18% was obtained at MD and ECAP.

Topics

• polymer
• grain
• grain size
• Oxygen
• extrusion
• molecular dynamics
• strength
• copper