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Waldron, F.
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document
Design, manufacture and testing of a low-cost micro-channel cooling device
Abstract
<p>The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented. © 2004 IEEE.</p>