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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Petrov, R. H. | Madrid |
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| Azevedo, Nuno Monteiro |
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Nazeri, Muhammad Firdaus Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2022Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heatingcitations
- 2021Microstructure and Phase Investigation of Sn-58Bi-xCu Lead-Free Solder After Immersion in Sodium Chloride Solution
- 2021Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite soldercitations
- 2020Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditionscitations
- 2020Selective etching and hardness properties of quenched SAC305 solder jointscitations
- 2020Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingcitations
- 2019Corrosion characterization of Sn-Zn solder: a review
- 2019Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acidcitations
- 2019Investigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
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document
Corrosion characterization of Sn-Zn solder: a review
Abstract
Yahaya, Muhamad Zamri/0000-0002-4750-4906; Mohd Nazeri, Muhammad Firdaus/0000-0003-4923-0184 ; WOS: 000458380500006 ; Purpose The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion will highlight the configurations and recent developments on each of the compiled characterization techniques of potentiodynamic polarization, potentiostatic polarization and electrochemical impedance spectroscopy (EIS). Design/methodology/approach The approach will incorporate a literature review of previous works related to the experimental setups and common parameters. Findings The potentiostatic polarization, potentiodynamic polarization and EIS were found to provide crucial and vital information on the corrosion properties of Sn-Zn solders. Accordingly, this solder relies heavily on the amount of Zn available because of the inability to produce the intermetallic compound in between the elements. Further, the excellent mechanical properties and low melting temperature of the Sn-Zn solder is undeniable, however, the limitations regarding corrosion resistance present opportunities in furthering research in this field to identify improvements. This is to ensure that the corrosion performance can be aligned with the outstanding mechanical properties. The review also identified and summarized the advantages, recent trends and important findings in this field. Originality/value The unique challenges and future research directions regarding corrosion measurement in Sn-Zn solders were shown to highlight the rarely discussed risks and problems in the reliability of lead-free soldering. Many prior reviews have been undertaken of the Sn-Zn system, but limited studies have investigated the corrosive properties. Therefore, this review focuses on the corrosive characterizations of the Sn-Zn alloy system.