| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Hueting, Raymond
University of Twente
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2024A Systematic Comparison Study of Different Bonding Technologies for Large Substrate Attachment of Power Electronics
- 2020Epitaxial growth of full range of compositions of (1 1 1) PbZr1- xTixO3 on GaNcitations
- 2015Electrostatic analysis of n-doped SrTiO3 metal-insulator-semiconductor systemscitations
- 2014Analysis of thin-film PZT/LNO stacks on an encapsulated TiN electrodecitations
- 2012Extraction of second order piezoelectric parameters in bulk acoustic wave resonatorscitations
- 2011On the rule of thumb for flipping the dispersion relation in BAW devicescitations
- 2011Exploring Capacitance-Voltage measurements to find the Piezoelectric Coefficient of Aluminum Nitridecitations
- 2010BaxSr1-xTi1.02O3 metal-insulator-metal capacitors on planarized alumina substratescitations
- 2008The trade-off between tuning ratio and quality factor of BaxSr1-xTiO3 MIM capacitors on alumina substrates
- 2007Separation of intrinsic dielectric and resistive electrode losses in ferroelectric capacitors at radio frequencies
- 2006Electrical characterization of thin film ferroelectric capacitors
Places of action
| Organizations | Location | People |
|---|
document
A Systematic Comparison Study of Different Bonding Technologies for Large Substrate Attachment of Power Electronics
Abstract
<p>Solder joints, silver (Ag) sintering, and transient liquid phase (TLP) bonding are widely used bonding technologies for packaging power modules. Each technology has advantages and limitations regarding reliability, thermal conductance and cost. So far, these technologies have not been systematically compared, and in this work we aim to fill this gap. To this end, we have performed shear strength tests on different solder, sintered Ag and TLP joint samples as a function of aging via thermal cycling and high-temperature storage tests. The joint microstructure and failure modes were analyzed using a scanning electron microscope with energy-dispersive X-ray spectroscopy. The results of our study show that sintered Ag has the maximum shear strength both before and after aging of around 70 MPa, while solder joints have the lowest shear strength that decreases from 50 MPa to about 35 MPa after thermal cycling and aging. For TLP bonding, the shear strength remains essentially stable at about 50 MPa after aging due to intermetallic compound growth. TLP bonding thus has a higher reliability than solder joints and is a cost-effective bonding alternative to Ag sintering.</p>