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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Kashiwar, Ankush
University of Antwerp
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Tailoring Mechanical Properties and Shear Band Propagation in ZrCu Metallic Glass Nanolaminates Through Chemical Heterogeneities and Interface Densitycitations
- 2024Tailoring Mechanical Properties and Shear Band Propagation in ZrCu Metallic Glass Nanolaminates Through Chemical Heterogeneities and Interface Densitycitations
- 2024On the role of microstructural defects on precipitation, damage, and healing behavior in a novel Al-0.5Mg2Si alloycitations
- 2024Combining nano-DIC and ACOM TEM to study the ductility enhancement of aluminium films by grain boundary sliding
- 2023Precipitation, damage and healing behaviour in a new healable Al-0.5Mg2Si alloy
- 2023Suppressing hydrogen blistering in a magnesium-rich healable laser powder bed fusion aluminum alloy analyzed by in-situ high resolution techniquescitations
- 2023Controlled precipitation in a new Al-Mg-Sc alloy for enhanced corrosion behavior while maintaining the mechanical performancecitations
- 2022Shear banding-activated dynamic recrystallization and phase transformation during quasi-static loading of beta-metastable Ti-12 wt.% Mo alloycitations
- 2022Healing Damage in Friction Stir Processed Mg2Si reinforced Al alloy
- 2022Design, Friction Stir Processing and characterization of a new healable aluminium alloy
- 2022TEM investigations of deformation mechanisms in nanocrystalline metals and multilayered composites
- 2022Optimisation of the Thermoelectric Properties of Fe2VAl Thin Films Obtained by Co-sputtering
- 2022Shear banding-activated dynamic recrystallization and phase transformation during quasi-static loading of β-metastable Ti – 12 wt % Mo alloy
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document
Combining nano-DIC and ACOM TEM to study the ductility enhancement of aluminium films by grain boundary sliding
Abstract
The viscoplastic response of metallic nano-crystalline films has been widely studied in the literature by means of nanomechanical testing, such as with in situ TEM experiments [1], [2] or dedicated on chip test methods [3]. The enhancement of ductility (as compared to large grain samples) has been attributed to different mechanisms, including grain boundary sliding, grain growth or kinematic hardening due to dislocation pile up [2], [4]. However, observations of the polycrystal deformation are challenging due to highly refined grain sizes. The correlative methodology developed in this work allows probing the relationships between the microstructural changes and the total strain field, at a scale never resolved before – i.e. sample size of 2.5 x 25 µm and strain field resolution of 50 nm. The aluminium films deposited by sputtering (210 nm thickness) are mechanically loaded with an on chip method [3] and then observed after deformation in the transmission electron microscope (TEM). Nanoscale digital image correlation (nano-DIC) reveals multiple necking regions appearing at low plastic strains and further spreading along the sample gauge without leading to critical failure. Automated crystal orientation mapping (ACOM TEM) indicates that strain localization bands correspond to grain boundaries (GB) and that the global texture remains unchanged. The local shear amplitude achieved by such GB sliding correlates, to some extent, with the GB character. The complementary results obtained by both techniques shed some new light on the link between GB mediated plasticity and enhanced macroscopic ductility. REFERENCES [1] H. Idrissi et al., Applied Physics Letters, vol. 104, no. 10, p. 101903, 2014. [2] J. P. Liebig et al., Acta Materialia, vol. 215, p. 117079, 2021. [3] S. Gravier et al., J. Microelectromech. Syst., vol. 18, no. 3, pp. 555–569, 2009. [4] F. Mompiou et al., Acta Materialia, vol. 61, no. 1, pp. 205–216, 2013.