| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Graves, John
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (16/16 displayed)
- 2023Soldering tip and method
- 2023Selective soldering nozzles
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023The challenges in selective soldering and meeting training needs
- 2023Braze head and method
- 2022Thiourea Leachingcitations
- 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)citations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic fieldcitations
- 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textilescitations
- 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic fieldcitations
- 2014Functionalised copper nanoparticles as catalysts for electroless platingcitations
- 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacture
- 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacturecitations
- 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutionscitations
Places of action
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patent
Braze head and method
Abstract
<p>A braze head of a braze apparatus and a method of manufacturing a braze head of a braze apparatus, the braze head comprising: a body made of a first material; the connector is used for connecting the welding head to the near end of the selective brazing equipment; and a distal end having an outer surface, at least one region of the outer surface being made of a second material different from the first material, the second material having a solder infiltration property greater than the first material. The first material is preferably titanium or a titanium alloy, and the region is preferably formed on the first material by first forming a first coating on at least a first portion of the first material by a physical vapor deposition (PVD) process, the first portion underlying the region; then, at least a portion of the first coating is coated with the second material.</p>