Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2023Soldering tip and methodcitations
  • 2023Selective soldering nozzlescitations
  • 2023Braze head and methodcitations

Places of action

Chart of shared publication
Graves, John
3 / 16 shared
Wu, Liang
2 / 10 shared
Mcmaster, Sj
3 / 13 shared
Cobley, Andrew
1 / 38 shared
Chart of publication period
2023

Co-Authors (by relevance)

  • Graves, John
  • Wu, Liang
  • Mcmaster, Sj
  • Cobley, Andrew
OrganizationsLocationPeople

patent

Soldering tip and method

  • Graves, John
  • Wu, Liang
  • Monk, Nigel
  • Mcmaster, Sj
Abstract

<p>A soldering tip 10, for soldering apparatus (figure 5), may have titanium body portion 40; and a removable steel distal end 38 or outer steel coating (36, figure 3). Physical vapour deposition (PVD) or electrodeposition may be used to coat the body portion 40 with the outer steel coating (36, figure 3), possibly with an intermediate layer therebetween. The steel may have less than 2 wt% carbon and 5 wt% chromium; e.g. also comprising manganese, silicon, vanadium, phosphorus, sulphur, with the balance being iron. Silver steel may be used. The bit 10 may have a screw thread 28, for releasably attaching to the soldering apparatus (figure 5). Legs of an electrical component may be dipped into a bubble of molten solder, protruding from a through-bore 16 in the nozzle tip 10, before soldering the component to a printed circuit board (PCB) (figures 1 and 2).</p>

Topics
  • Carbon
  • silver
  • chromium
  • laser emission spectroscopy
  • physical vapor deposition
  • steel
  • Silicon
  • titanium
  • iron
  • electrodeposition
  • Manganese
  • vanadium
  • Phosphorus
  • Sulphur