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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Graves, John
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (16/16 displayed)
- 2023Soldering tip and method
- 2023Selective soldering nozzles
- 2023Analysis of Pre-Treatment Processes to Enable Electroplating on Nitrided Steel
- 2023The challenges in selective soldering and meeting training needs
- 2023Braze head and method
- 2022Thiourea Leachingcitations
- 2021Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)citations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2018Selective metallization of non-conductive materials by patterning of catalytic particles and the application of a gradient magnetic fieldcitations
- 2018Additive process for patterned metallized conductive tracks on cotton with applications in smart textilescitations
- 2018Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic fieldcitations
- 2014Functionalised copper nanoparticles as catalysts for electroless platingcitations
- 2013Ultrasonically enabled low temperature electroless plating for advanced electronic manufacture
- 2012Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacturecitations
- 2001The use of insoluble anodes in acid sulphate copper electrodeposition solutionscitations
Places of action
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patent
Soldering tip and method
Abstract
<p>A soldering tip 10, for soldering apparatus (figure 5), may have titanium body portion 40; and a removable steel distal end 38 or outer steel coating (36, figure 3). Physical vapour deposition (PVD) or electrodeposition may be used to coat the body portion 40 with the outer steel coating (36, figure 3), possibly with an intermediate layer therebetween. The steel may have less than 2 wt% carbon and 5 wt% chromium; e.g. also comprising manganese, silicon, vanadium, phosphorus, sulphur, with the balance being iron. Silver steel may be used. The bit 10 may have a screw thread 28, for releasably attaching to the soldering apparatus (figure 5). Legs of an electrical component may be dipped into a bubble of molten solder, protruding from a through-bore 16 in the nozzle tip 10, before soldering the component to a printed circuit board (PCB) (figures 1 and 2).</p>