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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Wu, Liang
Coventry University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2024Stoichiometry‐Induced Ferromagnetism in Altermagnetic Candidate MnTecitations
- 2023Soldering tip and method
- 2023Braze head and method
- 2021Hot Work Tool Steel Processed by Laser Powder Bed Fusion: A Review on Most Relevant Influencing Factorscitations
- 2020The effects of turmeric on the grain structure and properties of copper electrodeposited composites
- 2018Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodepositioncitations
- 2017Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodepositscitations
- 2015The role of nodules in the growth of Zn whiskers from alkaline cyanide-free Zn electrodepositscitations
- 2015Tin whisker mitigation by means of a postelectroplating electrochemical oxidation treatmentcitations
- 2013Effect of cold‐crystallization on the AC and DC conductive properties of polylactide biocomposites with carboxylic or neat large aspect ratio MWCNTcitations
Places of action
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patent
Soldering tip and method
Abstract
<p>A soldering tip 10, for soldering apparatus (figure 5), may have titanium body portion 40; and a removable steel distal end 38 or outer steel coating (36, figure 3). Physical vapour deposition (PVD) or electrodeposition may be used to coat the body portion 40 with the outer steel coating (36, figure 3), possibly with an intermediate layer therebetween. The steel may have less than 2 wt% carbon and 5 wt% chromium; e.g. also comprising manganese, silicon, vanadium, phosphorus, sulphur, with the balance being iron. Silver steel may be used. The bit 10 may have a screw thread 28, for releasably attaching to the soldering apparatus (figure 5). Legs of an electrical component may be dipped into a bubble of molten solder, protruding from a through-bore 16 in the nozzle tip 10, before soldering the component to a printed circuit board (PCB) (figures 1 and 2).</p>