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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Letellier, Juliette
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conferencepaper
Design of a Source Field-Plated Deep-Depletion Diamond MOSFETs
Abstract
International audience ; In the context of power semiconductor devices, ultra wide bandgap (UWBG) materials offer increased critical electric fields compared to wide-bandgap (WBG) materials [1]. It is the case of monocrystalline diamond which exhibits outstanding physical and thermal properties with, especially, a large critical electric field of 10MV.cm-1 [2] allowing to reach high breakdown voltages. This property combined to the reduced on-state resistance at high junction temperatures (typically 450K) makes diamond power devices a promising challenger to 4H-SiC and GaN based power devices [1]. Recently, a fabricated deep-depletion diamond (D3) MOSFET has reached a critical electric field of 5.4MV.cm-1 [3], far from the estimated 10MV.cm-1. Two-dimensional numerical simulations have pointed out an electric field crowding effect under the gate in both diamond and oxide (Al2O3) layers leading to a premature breakdown of the gate oxide at a drain-source bias of –175V. Consequently, in the view of achieving a 1kV breakdown voltage, specific designs are required to reduce the edge effects. One possible solution to reduce the electric-field crowding effect under the gate is the design of a field-plate, as proposed for Ga2O3 power devices [4]. In this work, a source-field plated diamond MOSFET is designed to match the requirement of 1kV breakdown voltage. The device architecture is based on the lateraldeep-depletion diamond MOSFETs which has been previously introduced [3]. Compared to this design, a passivation layer with Si3N4 is added underneath the field-plate to ensure a proper isolation of the active device. To quantify the capabilities of such design, two-dimensional device simulations are performed using Silvaco ATLAS to determine theoptimal sizing for the field-plate. Thereby, various field-plate extensions at the drain side, LFP, and field-plate heights, hFP, are investigated. Preliminary simulation results show a reduction of the peak electric field under the gate in both diamond and gate oxide layers, ...