Materials Map

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2022Design of a Source Field-Plated Deep-Depletion Diamond MOSFETscitations

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Chart of shared publication
Castelan, Anne
1 / 2 shared
Rouger, Nicolas, C.
1 / 4 shared
Couret, Marine
1 / 1 shared
Pernot, Julien
1 / 17 shared
Driche, Khaled
1 / 1 shared
Chart of publication period
2022

Co-Authors (by relevance)

  • Castelan, Anne
  • Rouger, Nicolas, C.
  • Couret, Marine
  • Pernot, Julien
  • Driche, Khaled
OrganizationsLocationPeople

conferencepaper

Design of a Source Field-Plated Deep-Depletion Diamond MOSFETs

  • Castelan, Anne
  • Rouger, Nicolas, C.
  • Couret, Marine
  • Letellier, Juliette
  • Pernot, Julien
  • Driche, Khaled
Abstract

International audience ; In the context of power semiconductor devices, ultra wide bandgap (UWBG) materials offer increased critical electric fields compared to wide-bandgap (WBG) materials [1]. It is the case of monocrystalline diamond which exhibits outstanding physical and thermal properties with, especially, a large critical electric field of 10MV.cm-1 [2] allowing to reach high breakdown voltages. This property combined to the reduced on-state resistance at high junction temperatures (typically 450K) makes diamond power devices a promising challenger to 4H-SiC and GaN based power devices [1]. Recently, a fabricated deep-depletion diamond (D3) MOSFET has reached a critical electric field of 5.4MV.cm-1 [3], far from the estimated 10MV.cm-1. Two-dimensional numerical simulations have pointed out an electric field crowding effect under the gate in both diamond and oxide (Al2O3) layers leading to a premature breakdown of the gate oxide at a drain-source bias of –175V. Consequently, in the view of achieving a 1kV breakdown voltage, specific designs are required to reduce the edge effects. One possible solution to reduce the electric-field crowding effect under the gate is the design of a field-plate, as proposed for Ga2O3 power devices [4]. In this work, a source-field plated diamond MOSFET is designed to match the requirement of 1kV breakdown voltage. The device architecture is based on the lateraldeep-depletion diamond MOSFETs which has been previously introduced [3]. Compared to this design, a passivation layer with Si3N4 is added underneath the field-plate to ensure a proper isolation of the active device. To quantify the capabilities of such design, two-dimensional device simulations are performed using Silvaco ATLAS to determine theoptimal sizing for the field-plate. Thereby, various field-plate extensions at the drain side, LFP, and field-plate heights, hFP, are investigated. Preliminary simulation results show a reduction of the peak electric field under the gate in both diamond and gate oxide layers, ...

Topics
  • impedance spectroscopy
  • simulation
  • semiconductor
  • two-dimensional