Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2013Ultrahigh-speed hybrid laser for silicon photonic integrated chipscitations

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Yvind, Kresten
1 / 17 shared
Semenova, Elizaveta
1 / 15 shared
Park, Gyeong Cheol
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Moerk, Jesper
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2013

Co-Authors (by relevance)

  • Yvind, Kresten
  • Semenova, Elizaveta
  • Park, Gyeong Cheol
  • Moerk, Jesper
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document

Ultrahigh-speed hybrid laser for silicon photonic integrated chips

  • Yvind, Kresten
  • Semenova, Elizaveta
  • Park, Gyeong Cheol
  • Ran, Qijiang
  • Moerk, Jesper
Abstract

Increasing power consumption for electrical interconnects between and inside chips is posing a real challenge to continue the performance scaling of processors/computers as predicted by D. Moore. In recent processors, energy consumption for electrical interconnects is half of power supplied and will be 80% in near future. This challenge strongly has motivated replacing electrical interconnects with optical ones even in chip level communications [1]. This chip-level optical interconnects need quite different performance of optoelectronic devices than required for conventional optical communications. For a light source, the energy consumption per sending a bit is required to be &lt;10 fJ/bit for on-chip interconnects and &lt;100 fJ/bit for off-chip interconnects; this is two or three orders of magnitude smaller than the conventional devices. To meet the energy/bit requirement, many innovative laser diode and light-emitting diode (LED) structures have been proposed so far. Our hybrid laser is one of<br/>these efforts [2].<br/><br/>The hybrid laser consists of a dielectric reflector, a III-V semiconductor active material, and a high-index-contrast grating (HCG) reflector formed in the silicon layer of a silicon-oninsulator (SOI) wafer. ‘Hybrid’ indicates that a III-V active material is wafer-bonded to a silicon SOI wafer. In the hybrid laser, light is vertically amplified between the dielectric and the HCG reflectors, while the light output is laterally emitted to a normal Si ridge waveguide that is connected to the HCG reflector. The HCG works as a vertical mirror as well as a vertical-to-lateral coupler. Very small field penetration into the HCG allows for 3-4 times smaller modal volume than typical vertical-cavity surface-emitting lasers (VCSELs). This leads to high direct modulation speed. Details on device operating mechanism will be<br/>explained in the lecture.<br/><br/>Recently, a nano light-emitting diode (LED) with energy/bit &lt; 1fJ/bit [3] and a nano laser diode with a buried heterostructure (BH) active material [4] have been recently reported in the literature. Additionally, device physics, engineering issue, and error-free light detection issue in quantum limit will be discussed in relation to these two structures.

Topics
  • impedance spectroscopy
  • surface
  • Silicon
  • III-V semiconductor