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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Krijnen, Gijs J. M.
University of Twente
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2021Model Code of Anisotropic Electrical Conduction in Layered 3D-Prints with Fused Deposition Modeling
- 20203D-Printing of a Lemon Battery via Fused Deposition Modelling and Electrodepositioncitations
- 2007Biomimetic micromechanical adaptive flow-sensor arrayscitations
- 2007Cricket inspired flow-sensor arrayscitations
- 2006A novel surface micromachining process to fabricate AlN unimorph suspensions and its application for RF resonatorscitations
- 2005Growth and surface characterization of piezoelectric AlN thin films on silicon (100) and (110) substratescitations
- 2005Surface micromachined fabrication of piezoelectric ain unimorph suspension devices for rf resonator applications
- 2005Micromachined fountain pen as a tool for atomic force microscope-based nanoelectrochemical metal depositioncitations
- 2005Multifunctional tool for expanding afm-based applicationscitations
- 2005Fabrication of surface micromachined ain piezoelectric microstructures and its potential apllication to rf resonators
- 2004Surface Micromachining Process for the Integration of AlN Piezoelectric Microstructures
- 2001Platinum patterning by a modified lift-off technique and its application in a silicon load cell
- 2000Wet and dry etching techniques for the release of sub-micrometre perforated membranescitations
- 2000Characterization of platinum lift off technique
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document
Surface Micromachining Process for the Integration of AlN Piezoelectric Microstructures
Abstract
We report a novel micromachining process to fabricate AlN (Aluminum Nitride) piezoelectric microstructures for actuator applications. Piezoelectric AlN thin films can be grown with (002) preferential orientation by means of RF reactive sputtering on various substrates. For this study, AlN was deposited on doped polysilicon layers, which act as both structural, and electrode layer. A thin layer of Cr was used as top electrode and as a mask for patterning of the AlN piezoelectric layer. Silicon oxide was used as a sacrificial layer. The structures were released by a freeze drying technique. Single run deposition of AlN and Cr turns out to be necessary to ensure good adhesion of the Cr layer to the AlN thin film during the sacrificial etching process either using BHF or HF. The released beams show compressive stress due to the AlN thin film. Further process development, using Cr seed layers to reduce stress, and device testing is in progress.