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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Krijnen, Gijs J. M.
University of Twente
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2021Model Code of Anisotropic Electrical Conduction in Layered 3D-Prints with Fused Deposition Modeling
- 20203D-Printing of a Lemon Battery via Fused Deposition Modelling and Electrodepositioncitations
- 2007Biomimetic micromechanical adaptive flow-sensor arrayscitations
- 2007Cricket inspired flow-sensor arrayscitations
- 2006A novel surface micromachining process to fabricate AlN unimorph suspensions and its application for RF resonatorscitations
- 2005Growth and surface characterization of piezoelectric AlN thin films on silicon (100) and (110) substratescitations
- 2005Surface micromachined fabrication of piezoelectric ain unimorph suspension devices for rf resonator applications
- 2005Micromachined fountain pen as a tool for atomic force microscope-based nanoelectrochemical metal depositioncitations
- 2005Multifunctional tool for expanding afm-based applicationscitations
- 2005Fabrication of surface micromachined ain piezoelectric microstructures and its potential apllication to rf resonators
- 2004Surface Micromachining Process for the Integration of AlN Piezoelectric Microstructures
- 2001Platinum patterning by a modified lift-off technique and its application in a silicon load cell
- 2000Wet and dry etching techniques for the release of sub-micrometre perforated membranescitations
- 2000Characterization of platinum lift off technique
Places of action
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article
Platinum patterning by a modified lift-off technique and its application in a silicon load cell
Abstract
In micro-electromechanical systems (MEMS) and micro-electronic devices there has been a strong demand for electrode materials which can survive in highly oxidizing and high-temperature environments. Platinum (Pt) is a good candidate for this, because it combines several attractive properties: low electrical resistance, high melting point and high chemical stability. However, the chemical stability is a problem for patterning Pt by wet chemical or dry etching. Standard lift-off seems to be a solution to this problem. A big problem in using standard lift-off is that platinum particles or wing tips (ears) may remain at the edges after lift-off. These wing tips protrude from the surface and may cause short circuits with an opposite electrode placed within 1 μm. Some authors reported briefly on a modified lift-off technique to overcome this problem. Before deposition, a resist is patterned on an insulator to define openings where the metal is to be deposited. Afterwards, a small cavity is etched in the insulator, which is mostly SiO2. The cavity facilitates the separation of the metal on the resist and the metal in the cavity. In this study the effect of cavity depth and sputtered metal thickness on wing tip formation is investigated. In addition, surface roughness, resistance and hillock formation of the as-deposited metals are measured. The modified lift-off technique has succesfully been applied in a silicon load cell with Ti/Pt electrodes.