693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Buttay, Cyril
Claude Bernard University Lyon 1
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2022Design of a test package for high voltage SiC diodes
- 2022Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquidscitations
- 2017Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductorscitations
- 2017High temperature ageing of microelectronics assemblies with SAC solder jointscitations
- 2017Robustness of SiC MOSFET under avalanche conditionscitations
- 2016Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensorscitations
- 2015Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Testcitations
- 2014Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg
- 2013Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloycitations
- 2013High Temperature Operation of SiC Converters
- 2013Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering
- 2013Die attach using silver sintering. Practical implementation and analysiscitations
- 2012Full densification of Molybdenum powders using Spark Plasma Sinteringcitations
- 2012Elaboration of Architectured Materials by Spark Plasma Sinteringcitations
- 2012Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applicationscitations
- 20123-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
- 2011Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
- 2011Elaboration of Architectured Materials by Spark Plasma Sinteringcitations
- 2011Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substratescitations
Places of action
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conferencepaper
Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg
Abstract
In this paper, we present a small (25x25x3 mm 3 ) power module that integrates two silicon-carbide (SiC) JFETs to form an inverter leg. This module has a sandwich" structure, i.e. the power devices are placed between two ceramic substrates, allowing for heat extraction from both sides of the dies. All interconnects are made by silver sintering, which offers a very high temperature capability (the melting point of pure silver being 961 °C). The risk of silver migration is assessed, and we show that Parylene-HT, a dielectric material that can sustain more than 300 °C, can completely coat the module, providing adequate protection.