693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Kerkhof, Joost Van
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (2/2 displayed)
Places of action
| Organizations | Location | People |
|---|
document
Photonic flip-chip assembly of InP on TriPleX with laser soldering
Abstract
We present a photonic flip-chip assembly for a 4 mm × 4.6 mm InP die with 58 electrical connections on a 16 mm × 8 mm TriPleX die by using laser soldering. Two laser soldering schemes are investigated and show reliable contacts with a 6 N shear force: (1) using a laser wavelength where silicon is highly transmissive (through-silicon laser soldering) and (2) using a laser wavelength where silicon is not transmissive (heat-conduction laser soldering).