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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Feuchter, Michael
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Morphological structure and mechanical properties of a nucleated Polyoxymethylene (POM) homopolymer resin processed under conventional injection molding conditions
- 2024Impact Characteristics and Repair Approaches of Distinct Bio-Based Matrix Composites: A Comparative Analysiscitations
- 2024Effect of different weft-knitted structures on the mechanical performance of bio-based flexible compositescitations
- 2024Manufacturing bio-based fiber-reinforced polymer composites: Process performance in RTM and VARI processescitations
- 2023Impact of Multiple Reprocessing on Properties of Polyhydroxybutyrate and Polypropylenecitations
- 2023Tensile properties of flexible composites with knitted reinforcements from various yarn materialscitations
- 2023Investigation of the Mechanical Properties of Sandwich Composite Panels Made with Recyclates and Flax Fiber/Bio-Based Epoxy Processed by Liquid Composite Moldingcitations
- 2022Dynamic mechanical response in epoxy nanocomposites incorporating various nano-silica architectures
- 2022Towards virtually optimized curing cycles for polymeric encapsulations in microelectronicscitations
- 2022Injection Molding Simulation of Polyoxymethylene Using Crystallization Kinetics Data and Comparison with the Experimental Processcitations
- 2021Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
- 2021Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronicscitations
- 2020Exploiting the Carbon and Oxa Michael Addition Reaction for the Synthesis of Yne Monomerscitations
- 2018Influence of environmental factors like temperature and humidity on MEMS packaging materials.citations
Places of action
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conferencepaper
Dynamic mechanical response in epoxy nanocomposites incorporating various nano-silica architectures
Abstract
This paper is a continuation of the previous work where the dielectric response (BDS) of epoxy nanocomposites filled with three types of nano-silica architectures, namely core (SiO 2 ), core-shell (SiO 2 )-(SiO 2 ) and hollow (h-SiO 2 ). was investigated. These samples were filled based on their respective nanoparticle surface area, keeping it theoretically constant across all samples. The aim is to better understand the molecular dynamics and physical mechanisms in dielectric nanocomposites to contribute towards developing materials with tailored properties. The samples were characterised based on their dynamic mechanical behaviour (DMA) and their T g was measured by DSC. Unlike BDS, there is no additional relaxation peak observed in DMA thermographs besides the conventionally known α and β. The T g of the samples increases as the size of the nanoparticles decreases. Analysis of the height, width and intensity of the tan δ of α relaxation peak suggests reduction in the localised modes of motion as the size of the nanoparticles reveals a internally plasticised nanocomposite system. The T g values obtained from DSC do not vary significantly across the samples. These key findings are discussed in details and demonstrate by providing further evidence that the additional relaxation observed in BDS measurements is potentially due to the presence of hydrogen bond interactions between the polymer matrix and the fillers. However, no significant impact on the viscoelastic-mechanical properties of the nanocomposites is evident.