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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Ramadan, Sami
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2024Analysis of plasmon modes in Bi2Se3/graphene heterostructures via electron energy loss spectroscopy
- 2024Electrodeposition of 2D layered tungsten diselenide thin films using a single source precursorcitations
- 2022Vertical and Lateral Electrodeposition of 2D Material Heterostructures
- 2021Electrodeposited WS 2 monolayers on patterned graphenecitations
- 2020Large-area electrodeposition of few-layer MoS2 on graphene for 2D material heterostructurescitations
- 2020Large-area electrodeposition of few-layer MoS 2 on graphene for 2D material heterostructurescitations
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document
Vertical and Lateral Electrodeposition of 2D Material Heterostructures
Abstract
Developing scalable techniques for growing 2D materials and their heterostructures is a major challenge that needs to be overcome before these materials can make an impact in industries. Electroplating (electrodeposition) is an industrially acceptable deposition technique that offers unique advantages. This work is divided into two main parts. First, we demonstrate controlled electrodeposition of uniform and continuous MoS2 and WS2 layers over a large-area and micropatterned graphene electrodes. Second, we present a novel electrode design that enables MoS2 to be grown laterally over insulating substrates, demonstrating lateral photodetector devices based on TiN/MoS2/TiN structure. Our goal is to show that electrodeposition can produce competitive quality of 2D materials which can potentially be scaled to wafer sizes in fabrication industries for device applications.