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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Beanland, Richard
University of Warwick
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2024Electrodeposition of 2D layered tungsten diselenide thin films using a single source precursorcitations
- 2022Mesoporous silica films as hard templates for electrodeposition of nanostructured goldcitations
- 2022Vertical and Lateral Electrodeposition of 2D Material Heterostructures
- 20222D material based optoelectronics by electroplating
- 20222D material based optoelectronics by electroplating
- 2021Electrodeposited WS 2 monolayers on patterned graphenecitations
- 2021Lateral growth of MoS2 2D material semiconductors over an insulator via electrodepositioncitations
- 2021Lateral growth of MoS 2 2D material semiconductors over an insulator via electrodepositioncitations
- 2020Large-area electrodeposition of few-layer MoS2 on graphene for 2D material heterostructurescitations
- 2020Controlling palladium morphology in electrodeposition from nanoparticles to dendrites via the use of mixed solvents
- 2020Assessment of acid and thermal oxidation treatments for removing sp 2 bonded carbon from the surface of boron doped diamondcitations
- 2020Data for Atomic level termination for passivation and functionalisation of silicon surfaces
- 2020Point defects and interstitial climb of 90° partial dislocations in brown type IIa natural diamondcitations
- 2020Controlling palladium morphology in electrodeposition from nanoparticles to dendrites <i>via</i> the use of mixed solventscitations
- 2020Controlling Pd Morphology in Electrodeposition from Nanoparticles to Dendrites via the use of Mixed Solventscitations
- 2020Large-area electrodeposition of few-layer MoS 2 on graphene for 2D material heterostructurescitations
- 2020Atomic level termination for passivation and functionalisation of silicon surfacescitations
- 2019Low bandgap GaInAsSb thermophotovoltaic cells on GaAs substrate with advanced metamorphic buffer layercitations
- 2019Low bandgap GaInAsSb thermophotovoltaic cells on GaAs substrate with advanced metamorphic buffer layer
- 2019Data for Defect dynamics in self-catalyzed III-V semiconductor nanowires
- 2018Tracking metal electrodeposition dynamics from nucleation and growth of a single atom to a crystalline nanoparticlecitations
- 2018Tracking Metal Electrodeposition Dynamics from Nucleation and Growth of a Single Atom to a Crystalline Nanoparticlecitations
- 2012Multiple hydrogen-bond array reinforced cellular polymer films from colloidal crystalline assemblies of soft latex particlescitations
- 2011Accuracy of composition measurement using X-ray spectroscopy in precipitate-strengthened alloys: Application to Ni-base superalloyscitations
- 2011Structure of planar defects in tilted perovskitescitations
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document
Vertical and Lateral Electrodeposition of 2D Material Heterostructures
Abstract
Developing scalable techniques for growing 2D materials and their heterostructures is a major challenge that needs to be overcome before these materials can make an impact in industries. Electroplating (electrodeposition) is an industrially acceptable deposition technique that offers unique advantages. This work is divided into two main parts. First, we demonstrate controlled electrodeposition of uniform and continuous MoS2 and WS2 layers over a large-area and micropatterned graphene electrodes. Second, we present a novel electrode design that enables MoS2 to be grown laterally over insulating substrates, demonstrating lateral photodetector devices based on TiN/MoS2/TiN structure. Our goal is to show that electrodeposition can produce competitive quality of 2D materials which can potentially be scaled to wafer sizes in fabrication industries for device applications.