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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Torki, K.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (6/6 displayed)
- 2005CMP service for prototyping and low volume production
- 2002CMP service for the access to advanced technologies
- 2002Access to microsystem technology: the CMP services solution
- 2002The CMP Service
- 2001CMP: the access to advanced low cost manufacturing
- 2001CMP provides the access to advanced low cost manufacturing
Places of action
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conferencepaper
CMP service for the access to advanced technologies
Abstract
International audience ; CMP aims at providing Universities, Research Laboratories and Industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6µ, DLP/4LM 0.35µ, SLP/6LM 0.25µ, SLP/6LM 0.18µ, SLP/6LM 0.12µ, BiCMOS DLP/DLM 0.8µ, SiGe HBT 0.8µ DLP/DLM, SiGe HBT 0.35µ SLP/5LM and GaAs HEMT 0.2µ. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8µ 0.6µ, BiCMOS DLP/DLM 0.8µ and HEMT GaAs 0.2µ, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micro-machining allowing to integrate MEMS only microstructures. Finally, the main processes for Multi-Chip Modules (MCMs) are also through CMP.