Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Naji, M.
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Amalu, Dr Emeka

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in Cooperation with on an Cooperation-Score of 37%

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Publications (19/19 displayed)

  • 2024Mineral wastes1citations
  • 2024Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package8citations
  • 2024Critical methods of geopolymer feedstocks activation for suitable industrial applications1citations
  • 2024Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability13citations
  • 2023Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging12citations
  • 2023Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors2citations
  • 2021Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions82citations
  • 2020Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loading13citations
  • 2019Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing10citations
  • 20193D printing of intricate sand cores for complex copper castingscitations
  • 2018Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.citations
  • 2016Effects of component stand-off height on reliability of solder joints in assembled electronic componentcitations
  • 2015Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assemblycitations
  • 2015A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly134citations
  • 2012High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height15citations
  • 2012High temperature reliability of lead-free solder joints in a flip chip assembly58citations
  • 2012Thermal management materials for electronic control unit5citations
  • 2012Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations18citations
  • 2011Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser modulecitations

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Kehinde, O.
1 / 1 shared
Hughes, David
4 / 16 shared
Depiver, Joshua A.
4 / 5 shared
Mallik, Sabuj
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Kehinde, Oluyemi
1 / 2 shared
Hughes, David J.
1 / 5 shared
Nebo, Sunday E.
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Njoku, Jude E.
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Ekere, Ndy
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Ekpu, Mathias
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Ogbodo, Eugene A.
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Depiver, Joshua Adeniyi
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Harmanto, Dani
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Sutherland, Luke
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Bhatti, Raj
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Ogunsemi, B.
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Zarmai, M. T.
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Oduoza, C. F.
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Ekere, N. N.
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Ekere, Ndy N.
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Otiaba, K. C.
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Bhatti, R. S.
1 / 1 shared
Mallik, S.
1 / 4 shared
Takyi, G.
1 / 1 shared
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Co-Authors (by relevance)

  • Kehinde, O.
  • Hughes, David
  • Depiver, Joshua A.
  • Mallik, Sabuj
  • Kehinde, Oluyemi
  • Hughes, David J.
  • Nebo, Sunday E.
  • Njoku, Jude E.
  • Ekere, Ndy
  • Ekpu, Mathias
  • Ogbodo, Eugene A.
  • Depiver, Joshua Adeniyi
  • Harmanto, Dani
  • Sutherland, Luke
  • Bhatti, Raj
  • Ogunsemi, B.
  • Zarmai, M. T.
  • Oduoza, C. F.
  • Ekere, N. N.
  • Ekere, Ndy N.
  • Otiaba, K. C.
  • Bhatti, R. S.
  • Mallik, S.
  • Takyi, G.
OrganizationsLocationPeople

document

3D printing of intricate sand cores for complex copper castings

  • Sutherland, Luke
  • Amalu, Dr Emeka
  • Hughes, David
Abstract

Copper cast machine components are largely used in high temperature applications. Provision of internal water cooling channels in the cast, coupled with the high thermal conductivity of copper, enables cast components to perform reliably in extreme temperature ambient. However, creation of geometrically intricate internal structures in the cast is critical to improving component’s cooling efficiency and service life. Unfortunately, many of the ideal complex internal structures (cores) either cannot be manufactured using traditional methods or are not cost competitive.<br/><br/>This research focuses on the proof of concept. It demonstrates printing sand cores for employment in the manufacture of copper castings with complex inner cooling channels. The technique of binder jetting is used. A binder is selectively deposited onto a sand bed at room temperature to reduce dimensional distortions. The binder jetted sand is printed into cores. The cores are placed into a sand mould and filled with molten copper. <br/><br/>Simulation method is employed to determine the properties of the printed cores. The results are compared with that of traditional cast samples. It is found that the printed cores have consistent properties compared with the handmade cores. The surface roughness of the internal core faces is 2.03 Ra (μm). Finning is not present due to the absence of split lines found in most traditional sand cores. <br/><br/>The use of binder jetting technique increases manufacturability of intricate geometric cores for copper sand casting.<br/>

Topics
  • impedance spectroscopy
  • surface
  • simulation
  • copper
  • thermal conductivity
  • sand casting
  • binder jetting