| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Amalu, Dr Emeka
Teesside University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2024Mineral wastescitations
- 2024Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Packagecitations
- 2024Critical methods of geopolymer feedstocks activation for suitable industrial applicationscitations
- 2024Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliabilitycitations
- 2023Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packagingcitations
- 2023Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistorscitations
- 2021Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositionscitations
- 2020Comparing and benchmarking fatigue behaviours of various SAC solders under thermo-mechanical loadingcitations
- 2019Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageingcitations
- 20193D printing of intricate sand cores for complex copper castings
- 2018Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.
- 2016Effects of component stand-off height on reliability of solder joints in assembled electronic component
- 2015Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assembly
- 2015A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assemblycitations
- 2012High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off heightcitations
- 2012High temperature reliability of lead-free solder joints in a flip chip assemblycitations
- 2012Thermal management materials for electronic control unitcitations
- 2012Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operationscitations
- 2011Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module
Places of action
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article
Effect of Temperature on Conductivity of PLA-Carbon 3D Printed Components.
Abstract
There is continued growth in 3D print technology utilising thermoplastic materials that include polylactic acid (PLA) to print components of systems. The electrical properties of 3D printed thermoplastic components are critical because the product’s conductivity is temperature dependent owing to the kinetics of breakage and reformation of their aggregated structure. This knowledge drives research to make 3D printed components more functional in terms of their electrical properties in addition to their mechanical properties. This research studies the effect of temperature on the conductivity of 3D printed components. The range of temperature T considered is 22 ˚C≤T≤55˚C . A conductive 3D print filament made of PLA and filled with 4% carbon black is printed using Fused Deposition Modelling (FDM). The layer height and infill ratio are varied while the material resistivity ρ is measured as a function of temperature change. The measured magnitudes of resistivity lies in the range of 29.38 Ω≤ρ≤6750 Ω. The ρ is found to be a parabolic function of T – depicting an increase to a maximum and subsequent decrease. The parabolic nature of the ρ function is most visible in sample 1 which demonstrates an absolute change in ρ of 26%. The sample consisting of 50% infill ratio and 0.2 mm layer thickness (STDev 0.446) demonstrates least response to variations in temperature with the range investigated. This investigation reports on the significance of processing variables of FDM on the thermal sensitivity of conductive 3D printed Components.