| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Morgen, Per
University of Southern Denmark
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2024Impact of drug compounds mechanical/deformation properties on the preparation of nano- and microsuspensionscitations
- 2024Impact of drug compounds mechanical/deformation properties on the preparation of nano- and microsuspensionscitations
- 2022Post-degradation case study of the membrane electrode assembly from a low-temperature PEMFC stack
- 2022Post-degradation case study of the membrane electrode assembly from a low-temperature PEMFC stack
- 2022En metode til at danne kobberlag på porøst aluminium oxid (PAO) på et substrat af aluminium legering ; A method for manufacturing copper film on porous aluminum oxide (pao) on an aluminum alloy substrate
- 2022Insights into Degradation of the Membrane–Electrode Assembly Performance in Low-Temperature PEMFC:the Catalyst, the Ionomer, or the Interface?citations
- 2022A method for manufacturing copper film on porous aluminum oxide (pao) on an aluminum alloy substrate
- 2022Insights into Degradation of the Membrane–Electrode Assembly Performance in Low-Temperature PEMFCcitations
- 2020Platinum recycling through electroless dissolution under mild conditions using a surface activation assisted Pt-complexing approachcitations
- 2020Platinum recycling through electroless dissolution under mild conditions using a surface activation assisted Pt-complexing approachcitations
- 2017Growth of aluminum oxide on silicon carbide with an atomically sharp interfacecitations
- 2016The effect of trace amounts of copper on the microstructure, stability and oxidation of macroporous silicon carbidecitations
- 2016The effect of trace amounts of copper on the microstructure, stability and oxidation of macroporous silicon carbidecitations
- 2016The role of aluminium as an additive element in the synthesis of porous 4H-silicon carbidecitations
- 2016The role of aluminium as an additive element in the synthesis of porous 4H-silicon carbidecitations
- 2015The role of Aluminium in the synthesis of Mesoporous 4H Silicon Carbide
- 2015The role of Aluminium in the synthesis of Mesoporous 4H Silicon Carbide
- 2013Investigations on sputter deposited LiCoO2 thin films from powder targetcitations
- 2009Self-activated, self-limiting reactions on Si surfaces
- 2006Epitaxial growth of Al on Si(1 1 1) with Cu buffer layerscitations
Places of action
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patent
A method for manufacturing copper film on porous aluminum oxide (pao) on an aluminum alloy substrate
Abstract
The invention relates to process for manufacturing a thin and stable copper film on a porous aluminum oxide (PAO) film on an aluminum alloy substrate. Initially, anodization of the aluminum alloy substrate results in a regularly ordered PAO film; and subsequently there is electrodeposited copper on this PAO/aluminum substrate, the electrodepositing comprises the use of direct current (DC), preferably 10-15 V, so as to deposit metallic copper both: 1) in the open pores of the regularly ordered PAO film, and 2) on the top of the regularly ordered PAO film, so as to form a copper film on top of the PAO film. The anodization is performed so as to improve the adhesion and electrochemical corrosion stability i.e. with no, or little, galvanic corrosion of the electrodeposited copper on the PAO/aluminum substrate. The copper coverage is substantially continuous on the PAO/aluminum substrate.