| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Mäntysalo, Matti
Tampere University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2025Enhancing specific capacitance and energy density in printed supercapacitors : The role of activated wood carbon and electrolyte dynamicscitations
- 2024Flexible screen-printed supercapacitors with asymmetric PANI/CDC–AC electrodes and aqueous electrolytecitations
- 2024Recyclability of novel energy harvesting and storage technologies for IoT and wireless sensor networkscitations
- 2024Monolithic supercapacitors prepared by roll-to-roll screen printingcitations
- 2023Wear reliability and failure mechanism of inkjet-printed conductors on paperboard substratecitations
- 2023Screen printable PANI/carbide-derived carbon supercapacitor electrode ink with chitosan bindercitations
- 2022Flexible Polymer Rectifying Diode on Plastic Foils with MoO3Hole Injection
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Design of Thin, High Permittivity, Multiband, Monopole-Like Antennas
- 2019A Fully Printed Ultra-Thin Charge Amplifier for On-Skin Biosignal Measurementscitations
- 2018High-resolution E-jet Enhanced MEMS Packaging
- 2017Inkjet printing technology for increasing the I/O density of 3D TSV interposerscitations
- 2017Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposercitations
- 2016Fabrication and electrical characterization of partially metallized vias fabricated by inkjetcitations
- 2015Metallization of high density TSVs using super inkjet technologycitations
- 2010Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate
- 2009Sintering of printed nanoparticle structures using laser treatment
Places of action
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document
High-resolution E-jet Enhanced MEMS Packaging
Abstract
High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).