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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Carbas, Rjc
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Topics
Publications (10/10 displayed)
- 2023Study on out-of-plane tensile strength of angle-plied reinforced hybrid CFRP laminates using thin-plycitations
- 2022A study of the fracture mechanisms of hybrid carbon fiber reinforced polymer laminates reinforced by thin-plycitations
- 2021Design of a new pneumatic impact actuator of a Split Hopkinson Pressure Bar (SHPB) setup for tensile and compression testing of structural adhesivescitations
- 2021Determination of fracture toughness of an adhesive in civil engineering and interfacial damage analysis of carbon fiber reinforced polymer-steel structure bonded jointscitations
- 2021Novel torsion machine to test adhesive jointscitations
- 2020Displacement rate effect in the fracture toughness of glass fiber reinforced polyurethanecitations
- 2019A strategy to reduce delamination of adhesive joints with composite substratescitations
- 2014Effect of Cure Temperature on the Glass Transition Temperature and Mechanical Properties of Epoxy Adhesivescitations
- 2013Effect of post-cure on the glass transition temperature and mechanical properties of epoxy adhesivescitations
- 2012EFFECT OF CURE TEMPERATURE ON THE GLASS TRANSITION TEMPERATURE OF AN EPOXY ADHESIVE
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document
EFFECT OF CURE TEMPERATURE ON THE GLASS TRANSITION TEMPERATURE OF AN EPOXY ADHESIVE
Abstract
This work was undertaken to improve the understanding of the effect of curing temperature in the glass transition temperature, Tg, of an epoxy adhesive. The curing process was the same for all tests, consisting of a curing stage followed by a post cure stage. The initial stage was performed at different temperatures while the post curing stage was always performed at room temperature until the adhesive was completely cured. T-g was found to vary as a function of the cure temperature of the adhesive. When cured below the glass transition temperature of the fully cured network, T-g infinity, the T-g is lower than the cure temperature. When cured above T-g infinity, the T-g is higher than the cure temperature.