| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Mäntysalo, Matti
Tampere University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2025Enhancing specific capacitance and energy density in printed supercapacitors : The role of activated wood carbon and electrolyte dynamicscitations
- 2024Flexible screen-printed supercapacitors with asymmetric PANI/CDC–AC electrodes and aqueous electrolytecitations
- 2024Recyclability of novel energy harvesting and storage technologies for IoT and wireless sensor networkscitations
- 2024Monolithic supercapacitors prepared by roll-to-roll screen printingcitations
- 2023Wear reliability and failure mechanism of inkjet-printed conductors on paperboard substratecitations
- 2023Screen printable PANI/carbide-derived carbon supercapacitor electrode ink with chitosan bindercitations
- 2022Flexible Polymer Rectifying Diode on Plastic Foils with MoO3Hole Injection
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitorscitations
- 2020Design of Thin, High Permittivity, Multiband, Monopole-Like Antennas
- 2019A Fully Printed Ultra-Thin Charge Amplifier for On-Skin Biosignal Measurementscitations
- 2018High-resolution E-jet Enhanced MEMS Packaging
- 2017Inkjet printing technology for increasing the I/O density of 3D TSV interposerscitations
- 2017Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposercitations
- 2016Fabrication and electrical characterization of partially metallized vias fabricated by inkjetcitations
- 2015Metallization of high density TSVs using super inkjet technologycitations
- 2010Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate
- 2009Sintering of printed nanoparticle structures using laser treatment
Places of action
| Organizations | Location | People |
|---|
document
Sintering of printed nanoparticle structures using laser treatment
Abstract
Printed intelligence is a promising new technology toproduce low-cost electronics. Non-conductive circuits canbe printed using nanoscale metal particle inks. Due tothe nanoscale size of the particles, the typicalsintering temperatures of 100-300 °C are only a fractionof the macroscopic melting point of the correspondingmaterials, thus allowing the use of paper or plasticsubstrates. Sintering of printed nanoparticle structuresusing lasertreatment has been investigated at VTT.Laser sintering can be utilized in manufacturing ofprinted conductor structures such as antennas, circuitsand sensors. A drop-on demand printer was used to printpatterns with metallo-organic silver nanoparticles on aflexible polyimide substrate. Laser sintering was madewith a 940 nm CW fiber coupled diode laser. Process wasoptimized using different laser power levels, lineseparation and repetition rounds. Conductivity of lasersintered samples was compared to conductivity of samplessintered in convectionoven.