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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Spinelli, José
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (37/37 displayed)
- 2022Laser remelting of AlSi10Mg(-Ni) alloy surfaces: influence of Ni content and cooling rate on the microstructure
- 2020Combined growth of alpha-Al and Bi in a Al-Bi-Cu monotectic alloy analyzed by in situ X-ray radiographycitations
- 2015High cooling rate cells, dendrites, microstructural spacings and microhardness in a directionally solidified Al–Mg–Si alloycitations
- 2013Microstructure and Mechanical Properties of Directionally Solidified Unmodified and Ni-Modified Sn-0.7wt%Cu Lead-Free Solder Alloycitations
- 2013Microstructure–wear behavior correlation on a directionally solidified Al–In monotectic alloycitations
- 2013Interrelation of cell spacing, intermetallic compounds and hardness on a directionally solidified Al–1.0Fe–1.0Ni alloycitations
- 2013Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Nicitations
- 2012Rapid solidification of an Al-5Ni alloy processed by spray formingcitations
- 2012Cellular growth during the transient directional solidification of Zn-rich Zn–Cu monophasic and peritectic alloyscitations
- 2012The effects of microstructure and intermetallic phases of directionally solidified Al–Fe alloys on microhardnesscitations
- 2012Microstructural development during transient directional solidification of a hypomonotectic Al–In alloycitations
- 2012Effects of cell morphology and macrosegregation of directionally solidified Zn-rich Zn–Cu alloys on the resulting microhardnesscitations
- 2011Microstructure morphologies during the transient solidification of hypomonotectic and monotectic Al–Pb alloyscitations
- 2011Growth of tertiary dendritic arms during the transient directional solidification of hypoeutectic Pb–Sb alloyscitations
- 2011Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloycitations
- 2011Correlation between dendrite arm spacing and microhardness during unsteady-state directional solidification of Al-Ni alloyscitations
- 2010Microstructural development during transient directional solidification of hypermonotectic Al–Bi alloyscitations
- 2010Microstructural development during transient directional solidification of hypermonotectic Al–Bi alloyscitations
- 2010SEM Characterization of Al<sub>3</sub>Ni Intermetallics and its Influence on Mechanical Properties of Directionally Solidified Hypoeutectic Al-Ni Alloyscitations
- 2010Cellular Microstructure and Mechanical Properties of a Directionally Solidified Al-1.0wt%Fe Alloycitations
- 2010The correlation between dendritic microstructure and mechanical properties of directionally solidified hypoeutectic Al-Ni alloyscitations
- 2010The effects of cell spacing and distribution of intermetallic fibers on the mechanical properties of hypoeutectic Al–Fe alloyscitations
- 2009Investigation of intermetallics in hypoeutectic Al–Fe alloys by dissolution of the Al matrixcitations
- 2009Gravity-driven inverse segregation during transient upward directional solidification of Sn–Pb hypoeutectic alloyscitations
- 2009Thermal parameters and microstructure during transient directional solidification of a monotectic Al–Bi alloycitations
- 2009Cellular growth during transient directional solidification of hypoeutectic Al–Fe alloyscitations
- 2009Corrigendum to “Cellular growth during transient directional solidification of hypoeutectic Al–Fe alloys” [J. Alloys Compd. 470 (2009) 589–599]citations
- 2009Inverse segregation during transient directional solidification of an Al–Sn alloy: Numerical and experimental analysiscitations
- 2009Microstructural evolution during upward and downward transient directional solidification of hypomonotectic and monotectic Al–Bi alloyscitations
- 2009Primary dendrite arm spacing during transient directional solidification of Al alloys with low redistribution coefficientscitations
- 2008Cellular/Dendritic Transition and Microstructure Evolution during Transient Directional Solidification of Pb-Sb Alloyscitations
- 2007The influences of macrosegregation, intermetallic particles, and dendritic spacing on the electrochemical behavior of hypoeutectic Al-Cu alloyscitations
- 2007The effects of a eutectic modifier on microstructure and surface corrosion behavior of Al-Si hypoeutectic alloyscitations
- 2006Cellular growth during transient directional solidification of Pb–Sb alloyscitations
- 2006Evaluation of heat transfer coefficients during upward and downward transient directional solidification of Al–Si alloyscitations
- 2006Effects of cell size and macrosegregation on the corrosion behavior of a dilute Pb–Sb alloycitations
- 2005Analysis of current dendritic growth models during downward transient directional solidification of Sn–Pb alloyscitations
Places of action
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document
Laser remelting of AlSi10Mg(-Ni) alloy surfaces: influence of Ni content and cooling rate on the microstructure
Abstract
AlSi10Mg alloys are widely employed in a variety of industries, including aerospace, automotive, and microelectronics. This is because of its low density, acceptable mechanical properties, acceptable corrosion resistance, and inexpensive application cost. Advantageous fluidity, a short solidification period, and minimal volumetric contraction are beneficial characteristics under processing such alloys. Despite being used as commercial alloys, the mechanical properties of the AlSi10Mg alloys still need to be improved. In line with this, the current focus of Al-based alloy development is mostly on modifying commercially available alloys. Under such context, Ni was used as an alloying element in this study to generate the Al3Ni intermetallics, distinguished by its improved mechanical strength. Furthermore, the thermal stability of the Al3Ni may be a benefit, particularly for high-temperature applications. The present study aims to investigate the solidification under low and high cooling rates of four alloys: AlSi10Mg, AlSi10Mg-1Ni, AlSi10Mg-2Ni, and AlSi10Mg-3Ni (wt.%). Samples were obtained by directional solidification (DS) and laser surface remelting (LSR) processes. The cooling rates were calculated for the DS samples and with extrapolation for LSR samples as well as with the use of a model from the literature. After testing several laser conditions, the results also include an examination of microstructural and hardness changes in the treated and untreated zones. The produced gradient of microstructures is fully characterized as well as used to evaluate cooling rates inside the laser molten pools. For energy densities of 400 J/mm2 and 100 J/mm2, the mean dendritic spacings, λ, of the three Ni-containing alloys at the laser molten pool yielded estimated cooling rates of approximately 1.5 × 104 °C/s and 4.7 × 104 °C/s, respectively. A model explaining the reversion of λ across the molten pool will be outlined.