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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Sridhar, Ashok
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2011Fabrication and mechanical characterisation of inkjet printed strain gauges
- 2010Inkjet Printing of 3D Metallic Silver Complex Microstructures
- 2009Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board materialcitations
- 2009A Comparative study of two conductive ink jet inks for fabrication of RF Circuit structures
- 2009Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures
- 2009A comparative study of two conductive inkjet inks for fabrication of RF circuit structures
- 2009Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substratescitations
- 2009Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Samecitations
- 2008Inkjet printing of functional inks on PCB materials
- 2007Adhesion Characterisation of Inkjet Printed Silver Tracks
- 2007Adhesion characterization of inkjet printed tracks
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article
Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Same
Abstract
This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF4/O2 plasma etching, in order to make it suitable for the fabrication of RF (radio frequency) circuit structures by a combination of inkjet printing and electroless plating. A statistical DoE (design of experiments) based on a CCRD (central composite rotatable design) was used to systematically vary the plasma etching parameters and explore the characteristics of the etching process. This experimental design yielded 31 substrates, all of which were assessed in terms of surface energy, surface roughness and adhesion. Out of these substrates, 5 were identified as having the most favourable surface characteristics. Finally, RF circuit structures in the form of S-band filters were fabricated on these substrates using an inkjet printing-electroless plating combination, and the RF performance of these structures was characterised and compared.