Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2024Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowirescitations
  • 2024Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Sizecitations
  • 2023Micron-scale additive manufacturing of binary and ternary alloys by electrohydrodynamic redox 3D printing8citations

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Spolenak, Ralph
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Willinger, Marc Georg
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Reiser, Alain
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Hammadi, Souzan
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Porenta, Nikolaus
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Menetrey, Maxence
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2024
2023

Co-Authors (by relevance)

  • Spolenak, Ralph
  • Willinger, Marc Georg
  • Reiser, Alain
  • Wang, Zhu-Jun
  • Hammadi, Souzan
  • Porenta, Nikolaus
  • Menetrey, Maxence
OrganizationsLocationPeople

document

Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires

  • Spolenak, Ralph
  • Nydegger, Mirco
Abstract

Droplet-confined electrodeposition enables a precise deposition of three dimensional, nanoscopic and high purity metal structures. It aspires to fabricate intricate microelectronic devices, metamaterials, plasmonic structures and functionalized surfaces. Yet, a major handicap of droplet-confined electrodeposition is the current lack of control over the process, which is owed to its dynamic nature and the nanoscopic size of the involved droplets. The deposition current offers itself as an obvious and real-time window into the deposition. Therefore, the current during droplet-confined deposition is analysed. Nucleation and growth dynamics are evaluated systematically. Our results indicate different deposition regimes and link current to both volume and morphology of deposited copper. This allows for optimized electroplating strategies and to calibrate the slicing algorithms necessary for a controlled deposition of 3D structures. The potential of selecting appropriate solvents further readies this novel technique for the reliable deposition of functional structures with submicron resolution.

Topics
  • impedance spectroscopy
  • morphology
  • surface
  • copper
  • electrodeposition
  • metamaterial
  • additive manufacturing