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Yamanakab, Kenta
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Adhesion mechanism of temperature effects on Sn coating on the carbon fiber reinforced polymer substrate by cold spray
Abstract
Metalization of carbon fiber reinforced polymers (CFRPs) composites by the surface modification method to enhance their electrical conductivity, thermal conductivity, electromagnetic shielding, erosion, and radiation protection, has a significant meaning in the aerospace field. In this study, Sn coating was successfully fabricated on the CFRP composite substrate via low-pressure cold spray under four gas temperatures (473K, 523K, 573K, and 623K). Their bonding mechanism was explored via the surface observation after peel-off adhesion strength, accompanying with surface temperature distribution investigation. The results indicates that we cannot obtain coating at 623 K, the epoxy matrix of the CFRP substrate was gradually eroded during deposition over 523 K. Meanwhile, Sn particles melt under 623 K condition. Three kinds of interfaces: Sn/epoxy, Sn/CF, and Sn/CF/epoxy are revealed as characteristics with respect to different gas temperatures to explore the bonding mechanisms.