Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Ihle, Martin

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Fraunhofer Institute for Ceramic Technologies and Systems

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (7/7 displayed)

  • 2024Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC2citations
  • 2022A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C4citations
  • 2021A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C1citations
  • 2021A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C1citations
  • 2014Synthesis of nano metal particles for low sintering conductive inkscitations
  • 2014Aerosol jet printing of two component thick film resistors on LTCCcitations
  • 2012Aerosol Printing of High Resolution Films for LTCC-Multilayer Components2citations

Places of action

Chart of shared publication
Jäger, Jonas
1 / 1 shared
Zimmermann, Andre
1 / 1 shared
Gläser, Kerstin
1 / 2 shared
Braun, Sebastian
2 / 3 shared
Kordas, Norbert
2 / 4 shared
Utz, Alexander
2 / 2 shared
Kappert, Holger
2 / 8 shared
Rämer, Olaf
2 / 3 shared
Kokozinski, Rainer
2 / 3 shared
Ziesche, Steffen
2 / 9 shared
Weber, Constanze
2 / 5 shared
Kosfeld, Andre
2 / 2 shared
Spanier, Malte
2 / 4 shared
Fritsch, Marco
1 / 12 shared
Mosch, Sindy
2 / 8 shared
Jurk, Robert
2 / 2 shared
Eberstein, Markus
1 / 12 shared
Dietzen, E.
1 / 2 shared
Partsch, Uwe
2 / 15 shared
Swiecinski, K.
1 / 2 shared
Goldberg, Adrian
1 / 2 shared
Chart of publication period
2024
2022
2021
2014
2012

Co-Authors (by relevance)

  • Jäger, Jonas
  • Zimmermann, Andre
  • Gläser, Kerstin
  • Braun, Sebastian
  • Kordas, Norbert
  • Utz, Alexander
  • Kappert, Holger
  • Rämer, Olaf
  • Kokozinski, Rainer
  • Ziesche, Steffen
  • Weber, Constanze
  • Kosfeld, Andre
  • Spanier, Malte
  • Fritsch, Marco
  • Mosch, Sindy
  • Jurk, Robert
  • Eberstein, Markus
  • Dietzen, E.
  • Partsch, Uwe
  • Swiecinski, K.
  • Goldberg, Adrian
OrganizationsLocationPeople

article

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

  • Ihle, Martin
Abstract

<jats:title>Abstract</jats:title><jats:p>Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical load do not allow a reliable operation of sensitive electronic components. Fraunhofer is running the Lighthouse Project ‘eHarsh’ to overcome this hurdle. In the course of the project an integrated sensor readout electronic has been realized based on a set of three chips. A dedicated sensor frontend provides the analog sensor interface for resistive sensors typically arranged in a Wheatstone configuration. Furthermore, the chipset includes a 32-bit microcontroller for signal conditioning and sensor control. Finally, it comprises an interface chip including a bus transceiver and voltage regulators. The chipset has been realized in a high temperature 0.35 micron SOI-CMOS technology focusing operating temperatures up to 300 °C. The chipset is assembled on a multilayer ceramic LTCC-board using flip chip technology. The ceramic board consists of 4 layers with a total thickness of approx. 0.9 mm. The internal wiring is based on silver paste while external contacts were alternatively manufactured in silver (sintering/soldering) or in gold-alloys (wire bonding). As interconnection technology, silver sintering has been applied. It has already been shown that a significant increase in lifetime can be reached by using silver sintering for die attach applications. Using silver sintering for flip chip technology is a new and challenging approach. By adjusting the process parameter geared to the chipset design and the design of the ceramic board high quality flip chip interconnects can be generated.</jats:p>

Topics
  • impedance spectroscopy
  • silver
  • gold
  • ceramic
  • wire
  • sintering