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Andreassen, Erik
SINTEF
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Publications (7/7 displayed)
- 2024Thermally conductive polymer composites with hexagonal boron nitride for medical device thermal managementcitations
- 2023Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Castingcitations
- 2022On the temperature dependence of the cyclic compression behaviour of a thermoplastic vulcanizate elastomercitations
- 2022Cyclic Compression Testing of Three Elastomer Types— A Thermoplastic Vulcanizate Elastomer, a Liquid Silicone Rubber and Two Ethylene-Propylene-Diene Rubberscitations
- 2020Adhesion between thermoplastic elastomers and polyamide‐12 with different glass fiber fractions in two‐component injection moldingcitations
- 2019Determination of Anisotropic Mechanical Properties for Materials Processed by Laser Powder Bed Fusioncitations
- 2018Determination of Anisotropic Mechanical Properties for Materials Processed by Laser Powder Bed Fusioncitations
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document
Thermally conductive polymer composites with hexagonal boron nitride for medical device thermal management
Abstract
<jats:p>Polymer composites with hexagonal boron nitride (hBN) have the potential to meet the heat dissipation and electrical insulation requirements of electronic and medical devices. In this study, hBN/polymer composites were fabricated with thermoplastic polyurethane (TPU) and epoxy as matrix materials. Three hBN powder types (BN1, BN2, BN3) with different platelet sizes and degrees of agglomeration were used. BN1 (with average size of 1 μm) and BN2 (with average size of 12 μm) mainly contained hBN platelets, while BN3 (with average size of 20 μm) contained both platelets and agglomerates of platelets. BN2 gave the highest thermal conductivity, while BN1 gave the lowest thermal conductivity. Thermal simulations were performed for a medical device with a limit for the maximum surface temperature. For the encapsulation of this device, several material combinations were simulated, using anisotropic thermal conductivity data. This included encapsulations with inner layers of commercial thermally and electrically conductive materials and an outer layer of the best thermally conductive (and electrically insulating) hBN/TPU composite fabricated by the authors.</jats:p>