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Michalski, Andrzej
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Topics
Publications (13/13 displayed)
- 2019Microstructure and thermoelectric properties of p and n type doped β-FeSi2 fabricated by mechanical alloying and pulse plasma sinteringcitations
- 2018Structure and mechanical properties of TiB 2 /TiC – Ni composites fabricated by pulse plasma sintering methodcitations
- 2017Design of interfacial Cr 3 C 2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applicationscitations
- 2011W/steel joint fabrication using the pulse plasma sintering (PPS) methodcitations
- 2010Nanocrystalline WC with non-toxic Fe-Mn bindercitations
- 2010Properties of WCCo/diamond composites produced PPS method intended for drill bits for machining of building stonescitations
- 2008Heat Sink Materials Processing by Pulse Plasma Sinteringcitations
- 2007Nanocrystalline cemented carbides sintered by the pulse plasma methodcitations
- 2006Nanocrystalline Cemented Carbides Sintered by the Pulse Plasma Methodcitations
- 2006Nanocrystalline Cu-Al2O3 Composites Sintered by the Pulse Plasma Techniquecitations
- 2006NiAl–Al2O3 composites produced by pulse plasma sintering with the participation of the SHS reactioncitations
- 2004Phase transformations in ball milled AISI 316L stainless steel powder and the microstructure of the steel obtained by its sintering
- 2002Fabrication, structure and consolidation of NiAl-Al <inf>2</inf> O <inf>3</inf> mechanically alloyed nanocomposite powders
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article
Nanocrystalline Cemented Carbides Sintered by the Pulse Plasma Method
Abstract
Nanocrystalline WC-12wt.%Co was consolidated by Pulse Plasma Sintering (PPS) at various temperatures between 900 and 1200oC for 6 minutes under a pressure of 60MPa. Cemented carbides sintered at 1100oC have a relative density of 99%, a hardness of 2248HV30, the fracture toughness, KIC=12.5 MPa*m1/2, and have a structure containing 50nm WC crystallites. Increasing the sintering temperature to 1200oC causes an increase in the size of the WC crystallite size to about 110 nm, reduces the hardness to 2198HV30, and decreases the KIC to 9.7 MPa*m1/2.