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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Nogita, Kazuhiro
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Topics
Publications (8/8 displayed)
- 2021Microstructure Evolution of Ag/TiO2 Thin Filmcitations
- 2020Effect of Na and Cooling Rate on the Activation of Mg–Ni Alloys for Hydrogen Storagecitations
- 2016Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewcitations
- 2013Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planescitations
- 2012A new phase in stoichiometric Cu6Sn5citations
- 2010Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfacecitations
- 2009Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratescitations
- 2008Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
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document
Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface
Abstract
The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/ Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062x10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.